Thermal Science - scientific journal [ keyword: three-dimensional integrated circuits ]

THERMAL SCIENCE

International Scientific Journal

[ keyword: three-dimensional integrated circuits ]

Papers published in THERMAL SCIENCE also containing keyword three-dimensional integrated circuits

Thermal model for 3-D integrated circuits with integrated MLGNR-based through silicon via

THERMAL SCIENCE, volume 24, Issue 3, YEAR 2020

all keywords related to this paper

Thermal model, three-dimensional integrated circuits, MLGNR-based TSV

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

THERMAL SCIENCE, volume 27, Issue 5, YEAR 2023

all keywords related to this paper

three-dimensional integrated circuits, irregular structure, numerical simulation, through-silicon via, equivalent thermal conductivity model, Maximum Temperature

A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of three-dimensional integrated circuits

all keywords related to this paper

three-dimensional integrated circuits, heat dissipation structure, heat transfer performance