THERMAL SCIENCE

International Scientific Journal

Authors of this Paper

External Links

Peng Xu

,

Huan Huang

,

Fa Zou

,

Chun Shan

A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS

ABSTRACT
This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSV) and micro-channels to solve the complex heat problems of 3-D integrated circuits (3-D-IC). The COMSOL simulation model is established to investigate the characteristIC of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., Case 4: 3-D-IC with embedded both TSV and micro-channels) can reduce steady-state temperature over 43.546%, 18.440%, and 12.338% in comparison Case 1 (i.e., 3-D-IC without embedded heat dissipation structure), Case 2 (i.e., 3-D-IC with only inserted TSV), and Case 3 (i.e., 3-D-IC with only embedded micro-channels), respectively. Besides, it is demonstrated that CNT as filler material of TSV and CNT nanofluid as coolant of micro-channels (i.e., the proposed Scheme 4) can further reduce steady-state temperature of 3D-IC with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of Scheme 4 is reduced by 13.767% as compared with Scheme 1 (i.e., the conventional Cu as filler material of TSV and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3-D-IC with embedded the proposed heat dissipation structure can be enhanced by the increase of TSV radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3-D-IC.
KEYWORDS
three-dimensional integrated circuits, heat dissipation structure, heat transfer performance
PAPER SUBMITTED: 2024-06-10
PAPER REVISED: 2024-07-30
PAPER ACCEPTED: 2024-08-12
PUBLISHED ONLINE: 2024-08-31
DOI REFERENCE: https://doi.org/10.2298/TSCI240610202X
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2025, VOLUME 29, ISSUE Issue 2, PAGES [873 - 887]
REFERENCES
  1. Che, F. X., et al., Reliability Study of 3-D IC Packaging Based on Through-Silicon Interposer (TSI) and Silicon-Less Interconnection Technology (SLIT) Using Finite Element Analysis, Microelectron. Reliab., 61 (2016), June, pp. 64-70
  2. Xu, P., Pan, Z.-L., Thermal Model for 3-D Integrated Circuits with Integrated MLGNR-Based through Silicon Via, Thermal Science, 24 (2020), 3B, pp. 2067-2075
  3. Coudrain, P., et al., Experimental Insights into Thermal Dissipation in TSV-Based 3-D Integrated Circuits, IEEE Des. Test, 33 (2016), 3, pp. 21-36
  4. Dhananjay, K., et al., Monolithic 3-D Integrated Circuits: Recent Trends and Future Prospects, IEEE Trans. Circuits Syst. II Express Briefs, 68 (2021), 3, pp. 837-843
  5. Ge, C., et al., Equivalent Thermal Conductivity Modelling of Through-Silicon Via (TSV) Structures, Proceedings, International Conference on Integrated Circuits, Technologies and Applications (ICTA), Beijing, China, 2018, pp. 164-165
  6. Savidis, I., et al., Electrical Modelling and Characterization of Through-Silicon Vias (TSV) for 3-D Integrated Circuits, Microelectron. J., 41 (2010), 1, pp. 9-16
  7. Barua, A., et al., Thermal Management in 3-D Integrated Circuits with Graphene Heat Spreaders, Phys. Procedia, 25 (2012), Apr., pp. 311-316
  8. Liu, Z., et al., Compact Lateral Thermal Resistance Model of TSV for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked IC, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., 33 (2014), 10, pp. 1490-1502
  9. Rakesh, B., et al., Simplistic Approach to Reduce Thermal Issues in 3-D IC Integration Technology, Mater. Today Proc., 45 (2021), Part 2, pp. 1399-1402
  10. Zhao, Y., et al., TSV Assignment of Thermal and Wirelength Optimization for 3-D-IC Routing, Proceedings, 28th International Symposium on Power and Timing Modelling, Optimization and Simulation (PATMOS), Platja d'Aro, Spain, 2018, pp. 155-162
  11. Salvi, S. S., Jain, A., A Review of Recent Research on Heat Transfer in 3-D Integrated Circuits (3-D IC), IEEE Trans. Compon. Packag. Manuf. Technol., 11 (2021), 5, pp. 802-821
  12. Lau, J. H., Yue, T. G., Thermal Management of 3-D IC Integration with TSV (through Silicon Via), Proceedings, 59th Electronic Components and Technology Conference, San Diego, Cal., USA, 2009, pp. 635-640
  13. Kandlikar, S. G., Review and Projections of Integrated Cooling Systems for 3-D Integrated Circuits, J. Electron. Packag., 136 (2014), 2, 024001
  14. Huang, H., et al., The Integration of Double-Layer Triangular Micro-Channel in 3-D Integrated Circuits for Enhancing Heat Transfer Performance, Case Stud. Therm. Eng., 58 (2024), 104363
  15. Kearney, D., et al., A Liquid Cooling Solution for Temperature Redistribution in 3-D IC Architectures, Microelectron. J., 43 (2012), 9, pp. 602-610
  16. Islam, S., Motaleb, I. A., Investigation of the Dynamic of Liquid Cooling of 3-D IC, Proceedings, 8th International Symposium on Next Generation ElectronIC (ISNE), Zhengzhou, China, 2019, pp. 1-3
  17. Xiao, C., et al., An Effective and Efficient Numerical Method for Thermal Management in 3-D Stacked Integrated Circuits, Appl. Therm. Eng., 121 (2017), July, pp. 200-209
  18. Hou, L., et al., A Novel Thermal-Aware Structure of TSV Cluster in 3-D IC, Microelectron. Eng., 153 (2016), Mar., pp. 110-116
  19. Zajac, P., et al., On the Applicability of Single-layer Integrated Micro-channel Cooling in 3-D IC, Proceedings, 19th International Conference on Thermal, Mechanical and Multi-PhysIC Simulation and Experiments in MicroelectronIC and Microsystems (EuroSimE), Toulouse, France, 2018, pp. 1-6
  20. Ali, W. A. F. W., et al., Numerical Study of Laminar Flow in Pillared-micro-channel, Proceedings, IEEE Regional Symposium on Micro and NanoelectronIC (RSM), Batu Ferringhi, Penang, Malaysia, 2017, pp. 71-74
  21. Song, D., et al., Optimization and Analysis of Micro-channels Under Complex Power Distribution in 3-D IC, IEEE Trans. Compon. Packag. Manuf. Technol., 12 (2022), 3, pp. 537-543
  22. Narayan, V., Yao, S.-C., Modelling and Optimization of Micro-Channel Heat Sinks for the Cooling of 3-D Stacked Integrated Circuits, Proceedings, Fluids and Thermal Systems, Advances for Process Industries, Parts A and B, Denver, Col., USA, , 2011, Vol. 6, pp. 999-1011
  23. Roy, S. K., et al., A Thermal Estimation Model for 3-D IC Using Liquid Cooled Micro-Channels and Thermal TSV, Proceedings, IFIP/IEEE International Conference on Very Large-scale Integration (VLSI-SoC), Daejeon, South Korea, 2015, pp. 122-127
  24. Qian, H., et al., Thermal Simulator of 3-D-IC with Modelling of Anisotropic TSV Conductance and Micro-channel Entrance Effects, Proceedings, 18th Asia and South Pacific Design Automation Conference (ASP-DAC), Yokohama, Japan, 2013, pp. 485-490
  25. Che, J., et al., Thermal Conductivity of Carbon Nanotubes, Nanotechnology, 11 (2000), 2, pp. 65-69
  26. Xia, G. D., et al., The CharacteristIC of Convective Heat Transfer in Micro-Channel Heat Sinks Using Al2O3 and TiO2 Nanofluids, Int. Commun. Heat Mass Transf., 76 (2016), Aug., pp. 256-264
  27. Lenin, R., et al., A Review of The Recent Progress on Thermal Conductivity of Nanofluid, J. Mol. Liq., 338 (2021), 116929
  28. Ahmadi, M. H., et al., A Review of Thermal Conductivity of Various Nanofluids, J. Mol. Liq., 265 (2018), Sept., pp. 181-188
  29. Farsad, E., et al., Numerical Simulation of Heat Transfer in a Micro-channel Heat Sinks Using Nanofluids, Heat Mass Transf., 47 (2011), 4, pp. 479-490
  30. Mizunuma, H., et al., Thermal Modelling and Analysis for 3-D IC with Integrated Micro-Channel Cooling, IEEE Trans, Comput.-Aided Des. Integr. Circuits Syst., 30 (2011), 9, pp. 1293-1306
  31. Koo, J.-M., et al., Integrated Micro-channel Cooling for 3-D Electronic Circuit Architectures, J. Heat Transf., 127 (2005), 1, pp. 49-58
  32. Wang, K.-J., et al., An Analytical Thermal Model for 3-D Integrated Circuits With Integrated Micro-Channel Cooling, Thermal Science, 21 (2017), 4, pp. 1601-1606
  33. Lienhard, J. H., Lienhard, J. H., A Heat Transfer Textbook, Dover Publications, Inc., Mineola, New York, USA, 2019
  34. Sridhar, A., et al., The 3-D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled IC, IEEE Trans. Comput., 63 (2014), 10, pp. 2576-2589
  35. Vajjha, R. S., et al., Measurements of Specific Heat and Density of Al2O3 Nanofluid, Proceedings, AIP Conference Proceedings, Bhubaneswar, India, 2008, pp. 361-370
  36. Simon, N., et al., Properties of Copper and Copper Alloys at Cryogenic Temperatures, Final Report, Report No. PB-92-172766/XAB, NIST/MONO-177, 5340308, 1992
  37. Ho, C. Y., et al., Thermal Conductivity of the Elements, J. Phys. Chem. Ref. Data, 1 (1972), 2, pp. 279-421
  38. White, G. K., Collocott, S. J., Heat Capacity of Reference Materials: Cu and W, J. Phys. Chem. Ref. Data, 13 (1984), 4, pp. 1251-1257
  39. White, G. K., Minges, M. L., Thermophysical Properties of Some Key Solids: An Update, Int. J. Thermophys., 18 (1997), 5, pp. 1269-1327
  40. Xie, H., et al., Thermal Diffusivity and Conductivity of Multiwalled Carbon Nanotube Arrays, Phys. Lett. A, 369 (2007), 1-2, pp. 120-123
  41. Subramaniam, C., et al., One Hundred Fold Increase in Current Carrying Capacity in a Carbon Nanotube-Copper Composite, Nat. Commun., 4 (2013), 1, 2202
  42. Azmi, W. H., et al., Correlations for Thermal Conductivity and Viscosity of Water Based Nanofluids, IOP Conf. Ser. Mater. Sci. Eng., 36 (2012), 012029
  43. Xue, Q. Z., Model for Thermal Conductivity of Carbon Nanotube-Based Composites, Phys. B Condens. Matter, 368 (2005), 1-4, pp. 302-307
  44. Xuan, Y., Roetzel, W., Conceptions for Heat Transfer Correlation of Nanofluids, Int. J. Heat Mass Transf., 43 (2000), 19, pp. 3701-3707
  45. Pak, B. C., Cho, Y. I., Hydrodynamic and Heat Transfer Study of Dispersed Fluids with Submicron Metallic Oxide Particles, Exp. Heat Transf., 11 (1998), 2, pp. 151-170
  46. Bello-Ochende, T., et al., Constructal Cooling Channels for Micro-Channel Heat Sinks, Int. J. Heat Mass Transf., 50 (2007), 21-22, pp. 4141-4150
  47. Xu, P., et al., Thermal Performance Analysis of Carbon Materials Based TSV in 3-D Integrated Circuits, IEEE Access, 11 (2023), July, pp. 75285-75294
  48. Wang, K., Pan, Z., Thermal Management of the Die Bonding Architecture in 3-D-IC, Proceedings, 3rd International Conference on Advances in Energy and Environmental Science 2015, Zhuhai, China, 2015
  49. Shiyanovskii, Y., et al., Analytical Modelling and Numerical Simulations of Temperature Field in TSV-based 3-D IC, Proceedings, International Symposium on Quality Electronic Design (ISQED), Santa Clara, Cal., USA, 2013, pp. 24-29
  50. Yoshida, K., Morigami, H., Thermal Properties of Diamond/Copper Composite Material, Microelectron. Reliab., 44 (2004), 2, pp. 303-308
  51. Shoji, Y., et al., Cross-Linked Liquid Crystalline Polyimides with Siloxane Units: Their Morphology and Thermal Diffusivity, Macromolecules, 46 (2013), 3, pp. 747-755
  52. Sun, J., et al., Thermal Dissipation Performance of Metal-Polymer Composite Heat Exchanger with V-Shape Microgrooves: A Numerical and Experimental Study, Appl. Therm. Eng., 121 (2017), July, pp. 492-500
  53. Jumpholkul, C., et al., An Experimental Study to Determine the Maximum Efficiency Index in Turbulent Flow of SiO2/Water Nanofluids, Int. J. Heat Mass Transf., 112 (2017), Sept., pp. 1113-1121
  54. Jia, Y., et al., PSpice-COMSOL-Based 3-D Electrothermal-Mechanical Modelling of IGBT Power Module, IEEE J. Emerg. Sel. Top. Power Electron., 8 (2020), 4, pp. 4173-4185
PDF VERSION [DOWNLOAD]
A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of 3-D integrated circuits

2025 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence