THERMAL SCIENCE

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Zhao-Pei Xu

,

Kang-Jia Wang

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA

ABSTRACT
Through silicon via technology is a promising and preferred way to realize the reliable interconnection for 3-D integrated circuit (3-D IC), which can transfer heat from multiple dies to the heat sink in vertical direction. In this paper, a new gen¬eral model of the through-silicon via (TSV) is proposed to investigate the thermal performance of the 3-D IC. The heat transfer characteristics of conical-annular TSV are studied for the first time. The impacts of different sidewall inclination angles and insulating layer thicknesses of TSV on the heat dissipation of 3-D IC were compared and analyzed in detail. As expected, our proposed model is in good agreement with the results of the existing models, which shows that the proposed model considering the lateral heat transfer and TSV structures can predict the distribution of temperature more efficiently and accurately. Furthermore, it is found that conical-annular TSV has more excellent heat dissipation performance.
KEYWORDS
3-Dintegrated circuit, analytical thermal model, lateral heat transfer, conical-annular TSV
PAPER SUBMITTED: 2022-06-21
PAPER REVISED: 2022-08-01
PAPER ACCEPTED: 2022-08-08
PUBLISHED ONLINE: 2022-09-10
DOI REFERENCE: https://doi.org/10.2298/TSCI220621140X
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2023, VOLUME 27, ISSUE Issue 3, PAGES [2391 - 2398]
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An analytical thermal model for the 3-D integrated circuit with new-type through silicon via

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence