THERMAL SCIENCE

International Scientific Journal

Bo Cong

,

Ruiwen Liu

,

Yuxin Ye

,

Xiangbin Du

,

Lihang Yu

,

Nan Zhang

,

Shiqi Jia

,

Yanmei Kong

,

Binbin Jiao

INVESTIGATION ON THE HEAT DISSIPATION OF HIGH HEAT FLUX CHIP ARRAY BY FRACTAL MICROCHANNEL NETWORKS

ABSTRACT
With the development of integrated circuits, high power, and high integration chip array devices are facing the requirements of high heat flux and temperature uniformity. The micro-channel heat sink can meet the heat dissipation requirements of chip array devices with high heat flux, and the flow channel with fractal structure can achieve high temperature uniformity of chip array. In this study, the H-shaped fractal micro-channel structure was proposed to cooling the 4×4 chip (1 × 1 mm) array. The interior fillet structure was introduced to optimize T-shaped and L-shaped corner structures in the fractal channel. The simulation results show that the overall pressure drop of micro-channel heat sink with is reduced 18.7%, and the maximum temperature difference of 4×4 chip array is less than 1.2℃ at 1000 W/cm2. The micro-channel heat sink with interior fillet structure interior fillet structure was fabricated and assembled, and the hydro-thermal performance was characterized by thermal test chip at different flow rates and heat fluxes. The experimental results show that the standard deviation of temperature of 4×4 chip array is less than 3.5℃ at 1000 W/cm2 and 480 ml per minute. The error between experimental and simulation data is within ±1.5%, which proves the reasonability of CFD modelling and simulation. Furthermore, the results demonstrate that by introducing interior fillet structure into the T-shaped and L-shaped structures could reduce pumping power and improve temperature uniformity of chip array, which can be applied to improve the performance of the chip array devices with high heat flux.
KEYWORDS
chip array, TTC，fractal microchannel, temperature uniformity
PAPER SUBMITTED: 2022-03-15
PAPER REVISED: 2022-04-05
PAPER ACCEPTED: 2022-04-08
PUBLISHED ONLINE: 2022-06-04
DOI REFERENCE: https://doi.org/10.2298/TSCI220315079C
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2023, VOLUME 27, ISSUE Issue 1, PAGES [869 - 880]
REFERENCES
  1. Drummond, K. P., et al., A Hierarchical Manifold Micro-Channel Heat Sink Array for High-Heat-Flux Two-Phase Cooling of Electronics, International Journal of Heat and Mass Transfer, 117 (2018), Feb., pp. 319-330
  2. Lu, W., et al., Application of High-Thermal-Conductivity Diamond for Space Phased Array Antenna, Functional Diamond, 1 (2021), 1, pp. 189-196
  3. Li, Y., et al., Simulation and Characterization of Si-Based Micro-Channel for Module Level Cooling, Proceedings, 20th International Conference on Electronic Packaging Technology (ICEPT), Hong Kong, China, 2019
  4. Hu, D., et al., Numerical Study on Flow and Heat Transfer Characteristics of Micro-Channel Designed Us­ing Topological Optimizations Method, Science China Technological Sciences, 63 (2019), 1, pp. 105-115
  5. Tuckerman, D. B., Implications of High-Performance Heat Sinking for Electron Devices, IEEE Transac­tions on Electron Devices, 28 (1981), 10, pp. 1230-1231
  6. Zhou, J., et al., Flow Thermohydraulic Characterization of Hierarchical-Manifold Micro-Channel Heat Sink with Uniform Flow Distribution, Applied Thermal Engineering, 198 (2021), 117510
  7. He, Z., et al., Thermal Management and Temperature Uniformity Enhancement of Electronic Devices by Micro Heat Sinks: A Review, Energy, 216 (2021), 119223
  8. Sui, Y., et al., Fluid-Flow and Heat Transfer in Wavy Micro-Channels, International Journal of Heat and Mass Transfer, 53 (2010), 13-14, pp. 2760-2772
  9. Feng, S., et al., Thermal Management of 3-D Chip with Non-Uniform Hotspots by Integrated Gradient Distribution Annular-Cavity Micro-Pin Fins, Applied Thermal Engineering, 182 (2021), 116132
  10. Kumar, R., et al., Numerical Study on Mitigation of Flow Maldistribution in Parallel Micro-Channel Heat Sink: Channels width vs. Variable Height Approach, Journal of Electronic Packaging, 141 (2019), 2, 021009
  11. Zhang, D., Investigation on the Heat Transfer and Energy-Saving Performance of Micro-Channel with Cavities and Extended Surface, International Journal of Heat and Mass Transfer, 189 (2022), 122712
  12. Ma, D. D., et al., Design Study of Micro Heat Sink Configurations with Offset Zigzag Channel for Specif­ic Chips Geometrics, Energy Conversion and Management, 127 (2016), Nov., pp. 160-169
  13. Vafai, K., Zhu, L., Analysis of Two-Layered Micro-Channel Heat Sink Concept in Electronic Cooling, International Journal of Heat and Mass Transfer, 42 (1999), 12, pp. 2287-2297
  14. Zhai, Y. L., et al., Characteristics of Entropy Generation and Heat Transfer in Double-Layered Micro Heat Sinks with Complex Structure, Energy Conversion and Management, 103 (2015), Oct., pp. 477-486
  15. Bejan, A., Constructal-Theory Network of Conducting Paths for Cooling a Heat Generating Volume, International Journal of Heat and Mass Transfer, 40 (1997), 4, pp. 799-816
  16. Alharbi, A. Y., et al., Thermal Characteristics of Microscale Fractal-Like Branching Channels, Journal of Heat Transfer, 126 (2004), 5, pp. 744-752
  17. Chen, Y., et al., An Experimental Investigation on the Thermal Efficiency of Fractal Tree-Like Mi­cro-Channel Nets, International Communications in Heat and Mass Transfer, 32 (2005), 7, pp. 931-938
  18. Xie, G., et al., Constructal Design and Thermal Analysis of Micro-Channel Heat Sinks with Multistage Bifurcations in Single-Phase Liquid-Flow, Applied Thermal Engineering, 62 (2014), 2, pp. 791-802
  19. Hong, F. J., et al., Conjugate Heat Transfer in Fractal-Shaped Micro-Channel Network Heat Sink for Integrated Microelectronic Cooling Application, International Journal of Heat and Mass Transfer, 50 (2007), 25-26, pp. 4986-4998
  20. Wei, T., et al., Design and Fabrication of Multi-Layer Silicone Micro-channel Cooler for High-Power Chip Array, Poceedings, 22nd International Conference on Electronic Packaging Technology (ICEPT), Xiamen, China, 2021, pp. 1-5
  21. Ghaedamini, H., et al., The Effect of Svelteness on the Bifurcation Angles Role in Pressure Drop and Flow Uniformity of Tree-Shaped Micro-Channels, Applied Thermal Engineering, 31 (2011), 5, pp. 708-716
  22. Liu, H., Li, P., Even Distribution/Dividing of Single-Phase Fluids by Symmetric Bifurcation of Flow Channels, International Journal of Heat and Fluid-Flow, 40 (2013), Apr., pp. 165-179
  23. Zhang, C., et al., Investigations of Thermal and Flow Behavior of Bifurcations and Bends in Fractal-Like Micro-Channel Networks: Secondary Flow and Re-Circulation Flow, International Journal of Heat and Mass Transfer, 85 (2015), June, pp. 723-731
  24. Yan, Y., et al., Influence of Hydrogels Embedding Positions on Automatic Adaptive Cooling of Hot Spot in Fractal Micro-Channel Heat Sink, International Journal of Thermal Sciences, 155 (2020), 106428
  25. Ye, Y., et al., Investigation on Multidimensional Test Vehicle for Embedded Micro-Fluidic Cooling Per­formance Evaluation, Applied Thermal Engineering, 195 (2021), 117149
  26. Yeom, J., Shannon, M. A., 3.16-Micro-Coolers, Comprehensive Microsystems, (2008), pp. 499-550
  27. Zhang, N., et al., Experimental Investigation of the Embedded Micro-Channel Manifold Cooling for Power Chips, Thermal Science, 26 (2022), 2B, pp. 1531-1543
  28. Moffat, R. J., Describing the Uncertainties in Experimental Results, Experimental Thermal and Fluid Science, 1 (1988), 1, pp. 3-17
  29. Chen, Y., et al., Comparative Analysis between Water-Cooled and Air-Cooled Heat Dissipation in a high-Power Light-Emitting Diode Chipset, Journal of Thermal Science and Engineering Applications, 11 (2019), 6, 061002
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Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence