TY - JOUR
TI - Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks
AU - Cong Bo
AU - Liu Ruiwen
AU - Ye Yuxin
AU - Du Xiangbin
AU - Yu Lihang
AU - Zhang Nan
AU - Jia Shiqi
AU - Kong Yanmei
AU - Jiao Binbin
JN - Thermal Science
PY - 2023
VL - 27
IS - 1
SP - 869
EP - 880
PT - Article
AB - With the development of integrated circuits, high power, and high integration chip array devices are facing the requirements of high heat flux and temperature uniformity. The micro-channel heat sink can meet the heat dissipation requirements of chip array devices with high heat flux, and the flow channel with fractal structure can achieve high temperature uniformity of chip array. In this study, the H-shaped fractal micro-channel structure was proposed to cooling the 4×4 chip (1 × 1 mm) array. The interior fillet structure was introduced to optimize T-shaped and L-shaped corner structures in the fractal channel. The simulation results show that the overall pressure drop of micro-channel heat sink with is reduced 18.7%, and the maximum temperature difference of 4×4 chip array is less than 1.2℃ at 1000 W/cm2. The micro-channel heat sink with interior fillet structure interior fillet structure was fabricated and assembled, and the hydro-thermal performance was characterized by thermal test chip at different flow rates and heat fluxes. The experimental results show that the standard deviation of temperature of 4×4 chip array is less than 3.5℃ at 1000 W/cm2 and 480 ml per minute. The error between experimental and simulation data is within ±1.5%, which proves the reasonability of CFD modelling and simulation. Furthermore, the results demonstrate that by introducing interior fillet structure into the T-shaped and L-shaped structures could reduce pumping power and improve temperature uniformity of chip array, which can be applied to improve the performance of the chip array devices with high heat flux.