THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

online first only

Cooling enhancement of cubical shapes electronic components array including dummy elements inside a rectangular duct

ABSTRACT
In this work, numerical simulation has been done to study the cooling enhancement of electronic components of cubical shapes including dummy elements inside a rectangular duct. 12 electronic chips (3 x 4 array) of dimensions (50 mm x 50 mm x 10 mm) are tested in an air duct of dimensions (350 mm x 3500 mm x 60 mm). The aim of the simulation is to study the influence of changing positions of the hot components on the overall cooling performance at different Reynolds numbers. Moreover, the effect of spacing between electronic components is studied. This is achieved by changing the position of the heat sources while keeping other elements as dummies to keep the flow characteristics. The Reynolds number is in the range (500 to 19000). The standard k-ε, model is used and validated with experimental work showing good agreement. 37 cases per Reynolds are considered, resulting in an overall 259 studied cases. It is concluded in terms of the large resulting data from this study that, increasing the spacing between elements in the cooling fluid flow direction influences the cooling rate. Moreover, designers should be interested to operate such systems at optimized higher Reynolds values.
KEYWORDS
PAPER SUBMITTED: 2022-05-23
PAPER REVISED: 2022-07-13
PAPER ACCEPTED: 2022-07-15
PUBLISHED ONLINE: 2022-09-10
DOI REFERENCE: https://doi.org/10.2298/TSCI220523134R
REFERENCES
  1. Refaey H.A., Eslam E., Sakr R.Y., Abdelrahman H.E., Numerical and experimental study for heat transfer enhancement of cubical heat source and dummy elements inside rectangular duct, Heat and mass transfer 57 (2021) 1319-1328.
  2. Ali H.M., Arshad A., Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices, Int. J. Heat Mass Transf. 112(2017) 649-661. doi.org/10.1016/j.ijheatmasstransfer.2017.05.004
  3. Kumar A., Kothari R., Sahu S.K., Kundalwal S. I., Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components, Microelectronics Reliability 121 (2021) 114-144.
  4. Rehman T., Ali H. M., Experimental study on thermal behavior of RT-35HC paraffin within copper and iron-nickel open cell foams: energy storage for thermal management of electronics, Int. J. Heat Mass Transf. 146 (2020) 118852. doi.org/10.1016/j.ijheatmasstransfer.2019.118852
  5. Baby R., Balaji C., Experimental investigation on phase change material based finned heat sink for electronic equipment cooling, Int. J. Heat Mass Transf. 55(2012) 1644-1649. doi.org/10.1016/j.ijheatmasstransfer.2011.11.020
  6. Arshad A., Ali H.M., Khushnood S., Jabbal M., Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin fin diameter, Int. J. Heat Mass Transf. 117 (2018) 861-872.
  7. Mehdi Bahiraei, Saeed Heshmatian, Electronics cooling with nanofluids: A critical review, Energy Conversion and Management, Volume 172, 2018, Pages 438-456, ISSN 0196-8904, doi.org/10.1016/j.enconman.2018.07.047.
  8. M. Bahiraei, A. Monavari, Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilization in cooling of electronic components, Chinese Journal of Chemical Engineering (2020), doi: doi.org/10.1016/j.cjche.2020.11.026
  9. Greiner M., An experimental investigation of resonant heat transfer enhancement in grooved channels, Int J Heat Mass Transf 34 (6)(1991)1383-1391. doi.org/10.1016/0017-9310(91)90282-J
  10. Alam M., Bhattacharyya S., Souayeh B., Dey K., Hammami F., GorjiM., Biswas E., Ozbay O., CPU heat sink cooling by triangular shape micro-pin-fin: Numerical study, Int Commun Heat Mass Transfer 112 (2020)1 04455. doi.org/10.1016/j.icheatmasstransfer.2019.104455
  11. Ali R.K., Refaey H.A., Salem M.R., Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface, Appl Therm Eng 132 (2018) 676-685. doi.org/10.1016/j.applthermaleng.2018.01.006
  12. Farhanieh B., Herman C., Sunden B., Numerical and experimental analysis of laminar fluid flow and forced convection heat transfer in a grooved duct, Int J Heat Mass Transf 36(6)(1993)1609-1617 doi.org/10.1016/S0017-9310(05)80070-5
  13. Asako Y., Faghri M., Parametric study of turbulent three dimensional heat transfer of arrays of heated blocks encountered in electronic equipment, Int. J. Heat Mass Transfer 37(3) (1994) 469-478. doi.org/10.1016/0017-9310(94)90081-7
  14. Molki M., Fagri M., Temperature of in-line array of electronic components, Electron Cooling 6 (2) (2000) 26-32.
  15. Nakayama W., Park S.H., Conjugate heat transfer from a single surface-mounted block to forced convective air flow in a channel. Transactions of the ASME, J Heat Transf 118(1996)301-309
  16. Kurşun, B., Sivrioğlu, M. Heat transfer enhancement using U-shaped flow routing plates in cooling printed circuit boards. J Braz. Soc. Mech. Sci. Eng. 40, 13 (2018). doi.org/10.1007/s40430-017-0937-z
  17. M. Bahiraei, N. Mazaheri, M. Rasool Daneshyar, Employing elliptical pin-fins and nanofluid within a heat sink for cooling of electronic chips regarding energy efficiency perspective, Applied Thermal Engineering (2020), doi: doi.org/10.1016/j.applthermaleng.2020.116159
  18. Bahiraei M, Mazaheri N, Application of an ecofriendly nanofluid containing graphene nanoplatelets inside a novel spiral liquid block for cooling of electronic processors, Energy, doi.org/10.1016/j.energy.2020.119395