THERMAL SCIENCE

International Scientific Journal

H. A. Refaey

,

Bandar Awadh Almohammadi

,

Mostafa A. H. Abdelmohimen

,

Hany E. Abdelrahman

,

Mohamed A. Karali

COOLING ENHANCEMENT OF CUBICAL SHAPES ELECTRONIC COMPONENTS ARRAY INCLUDING DUMMY ELEMENTS INSIDE A RECTANGULAR DUCT

ABSTRACT
In this work, numerical simulation has been done to study the cooling enhancement of electronic components of cubical shapes including dummy elements inside a rectangular duct. The 12 electronic chips (3 × 4 array) of dimensions (50 mm × 50 mm × 10 mm) are tested in an air duct of dimensions (350 mm × 3500 mm × 60 mm). The aim of the simulation is to study the influence of changing positions of the hot components on the overall cooling performance at different Reynolds numbers. Moreover, the effect of spacing between electronic components is studied. This is achieved by changing the position of the heat sources while keeping other elements as dummies to keep the flow characteristics. The Reynolds number is in the range (500-19000). The standard k-ε, model is used and validated with experimental work showing good agreement. The 37 cases per Reynolds are considered, resulting in an overall 259 studied cases. It is concluded in terms of the large resulting data from this study that, increasing the spacing between elements in the cooling fluid-flow direction influences the cooling rate. Moreover, designers should be interested to operate such systems at optimized higher Reynolds values.
KEYWORDS
heat transfer, electronic device cooling, Heat source, Dummy, numerical
PAPER SUBMITTED: 2022-05-23
PAPER REVISED: 2022-07-13
PAPER ACCEPTED: 2022-07-15
PUBLISHED ONLINE: 2022-09-10
DOI REFERENCE: https://doi.org/10.2298/TSCI220523134R
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2023, VOLUME 27, ISSUE Issue 2, PAGES [1529 - 1538]
REFERENCES
  1. Refaey, H. A., et al., Numerical and Experimental Study for Heat Transfer Enhancement of Cubical Heat Source and Dummy Elements Inside Rectangular Duct, Heat and Mass Transfer, 57 (2021), Feb., pp. 1319-1328
  2. Ali, H. M., Arshad, A., Experimental Investigation of n-Eicosane Based Circular Pin-Fin Heat Sinks for Passive Cooling of Electronic Devices, Int. J. Heat Mass Transf., 112 (2017), Sept., pp. 649-661
  3. Kumar A., et al., Thermal Performance of Heat Sink Using Nanoenhanced Phase Change Material (NePCM) for Cooling of Electronic Components, Microelectronics Reliability, 121 (2021), June, pp. 114-144
  4. Rehman, T., Ali, H. M., Experimental Study on Thermal Behavior of RT-35HC Paraffin Within Copper and Iron-Nickel Open Cell Foams: Energy Storage for Thermal Management of Electronics, Int. J. Heat Mass Transf., 146 (2020), 118852
  5. Baby, R., Balaji, C., Experimental Investigation on Phase Change Material Based Finned Heat Sink for Electronic Equipment Cooling, Int. J. Heat Mass Transf., 55 (2012), 5-6, pp. 1644-1649
  6. Arshad, A., et al., Experimental Investigation of PCM Based Round Pin-Fin Heat Sinks for Thermal Management of Electronics: Effect of Pin Fin Diameter, Int. J. Heat Mass Transf., 117 (2018), Feb., pp. 861-872
  7. Bahiraei, M., Heshmatian, S., Electronics Cooling with Nanofluids: A Critical Review, Energy Conversion and Management, 172 (2018), Sept., pp. 438-456
  8. Bahiraei, M., Monavari, A., Impact of Nanoparticle Shape on Thermohydraulic Performance of a Nanofluid in an Enhanced Nicro-Channel Heat Sink for Utilization in Cooling of Electronic Components, Chinese Journal of Chemical Engineering, 40 (2021), Dec., pp. 36-47
  9. Greiner, M., An Experimental Investigation of Resonant Heat Transfer Enhancement in Grooved Channels, Int. J. Heat Mass Transf., 34 (1991), 6, pp. 1383-1391
  10. Alam, M., et al., The CPU Heat Sink Cooling by Triangular Shape Micro-Pin-Fin: Numerical Study, Int. Commun. Heat Mass. Transfer, 112 (2020), 104455
  11. Ali, R. K., et al., Effect of Package Spacing on Convective Heat Transfer from Thermal Sources Mounted on a Horizontal Surface, Appl. Therm. Eng., 132 (2018), Mar., pp. 676-685
  12. Farhanieh, B., et al., Numerical and Experimental Analysis of Laminar Fluid-Flow and Forced Convection Heat Transfer in a Grooved Duct, Int. J. Heat Mass Transf., 36 (1993), 6, pp. 1609-1617
  13. Asako, Y., Faghri, M., Parametric Ttudy of turbulent 3-D Heat Transfer of Arrays of Heated Blocks Encountered in Electronic Equipment, Int. J. Heat Mass Transfer, 37 (1994), 33, pp. 469-478
  14. Molki, M., Fagri, M., Temperature of in-Line Array of Electronic Components, Electron Cooling, 6 (2000), 2, pp. 26-32
  15. Nakayama, W., Park, S. H., Conjugate Heat Transfer from a Single Surface-Mounted Block to Forced Convective Air-Flow in a Channel, Transactions of the ASME, Journal Heat Transf., 118 (1996), 2, pp. 301-309
  16. Kursun, B., Sivrioglu, M., Heat Transfer Enhancement Using U-Shaped Flow Routing Plates in Cooling Printed Circuit Boards, Journal Braz. Soc. Mech. Sci. Eng., 40 (2018), 13
  17. Bahiraei, M., et al., Employing Elliptical Pin-Fins and Nanofluid Within a Heat Sink for Cooling of Electronic Chips Regarding Energy Efficiency Perspective, Applied Thermal Engineering, 183 (2020), 116159
  18. Bahiraei, M., Mazaheri, N., Application of an Ecofriendly Nanofluid Containing Graphene Nanoplatelets Inside a Novel Spiral Liquid Block for Cooling of Electronic Processors, Energy, 218 (2020), 119395
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Cooling enhancement of cubical shapes electronic components array including dummy elements inside a rectangular duct

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