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In this work, numerical simulation has been done to study the cooling enhancement of electronic components of cubical shapes including dummy elements inside a rectangular duct. The 12 electronic chips (3 × 4 array) of dimensions (50 mm × 50 mm × 10 mm) are tested in an air duct of dimensions (350 mm × 3500 mm × 60 mm). The aim of the simulation is to study the influence of changing positions of the hot components on the overall cooling performance at different Reynolds numbers. Moreover, the effect of spacing between electronic components is studied. This is achieved by changing the position of the heat sources while keeping other elements as dummies to keep the flow characteristics. The Reynolds number is in the range (500-19000). The standard k-ε, model is used and validated with experimental work showing good agreement. The 37 cases per Reynolds are considered, resulting in an overall 259 studied cases. It is concluded in terms of the large resulting data from this study that, increasing the spacing between elements in the cooling fluid-flow direction influences the cooling rate. Moreover, designers should be interested to operate such systems at optimized higher Reynolds values.
PAPER REVISED: 2022-07-13
PAPER ACCEPTED: 2022-07-15
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THERMAL SCIENCE YEAR 2023, VOLUME 27, ISSUE Issue 2, PAGES [1529 - 1538]
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