International Scientific Journal

Authors of this Paper

External Links


Different stacked structures affect greatly the temperature distribution of a 3-D integrated circuit, and an optimal structure is much needed to reduce the maximal temperature. This paper suggests a numerical approach to such structures with different heat source distributions. The results show that an optimal stacked structure can reduce the maximum temperature by 8.7℃.
PAPER REVISED: 2020-06-20
PAPER ACCEPTED: 2020-06-20
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2021, VOLUME 25, ISSUE Issue 3, PAGES [2221 - 2225]
  1. Zhao, Y., et al., Thermal and Wirelength Optimization With TSV Assignment for 3-D-IC, IEEE Trans-actions On Electron Devices, 66 (2019), 1, pp. 625-632
  2. Wang, K. J., et al., Thermal Management of the Through Silicon Vias In 3-D Integrated Circuits, Thermal Science, 23 (2019), 4, pp. 2157-2162
  3. Hou, L. G., A Method to Alleviate Hot Spot Problem in 3-D IC, Microelectronic Engineering, 190 (2018), Apr., pp. 19-27
  4. Wang, K. J., et al., Integrated Microchannel Cooling In A Three Dimensional Integrated Circuit A Thermal Management, Thermal Science, 20 (2017), 3, pp. 899-902
  5. Wang, K. J., et al., Thermal Management Of The Hotspots In 3-D Integrated Circuits, Thermal Science, 22 (2018), 4, pp. 1685-1690
  6. Lu, T., et al., TSV-Based 3-D IC: Design Methods and Tools, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 36 (2017), 10, pp. 1593-1619
  7. Wang, K. J., Wang, G. D., Variational Principle and Approximate Solution for the Fractal Generalized Benjamin-Bona-Mahony-Burgers Equation in Fluid Mechanics, Fractals, On-line first, doi. org/10.1142/S0218348X21500754, 2021
  8. Feng, Z., Li, P., Fast Thermal Analysis on GPU for 3-D IC With Integrated Microchannel Cooling, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 21 (2013), 8, pp. 1526-1539
  9. Wang, K. J., A New Fractional Nonlinear Singular Heat Conduction Model for the Human Head Considering the Effect of Febrifuge, Eur. Phys. J. Plus, 135 (2020), Nov., ID 871
  10. Patti, R. S., 3-D Integrated Circuits and the Future of System-On-Chip Designs, Proceedings of the IEEE, 94 (2006), 6, pp. 1214-1224
  11. YOON, J. K., et al., Thermal Characterization Of Interlayer Microfluidic Cooling Of 3-D Integrated Circuits With Nonuniform Heat Flux, Journal of Heat Transfer, 132 (2010), 4, pp. 041009-041018
  12. Banerjee, K.. Mehrotra, A., Global (Interconnect) Warming, IEEE Circuits Devices Mag., 17 (2001), 5, pp. 16-32
  13. Wang, K. J., et al., An Analytical Model for Steady-state and Transient Temperature Fields in 3-D Integrated Circuits, IEEE Transactions on Components Packaging & Manufacturing Technology, 6 (2016), 7, pp. 1028-1041
  14. Wang, K. J., Variational Principle and Approximate Solution for the Generalized Burgers-Huxley Equation with Fractal Derivative, Fractals, On-line first,, 2021
  15. Bagnall, K. R., et al., Analytical Solution for Temperature Rise in Complex Multilayer Structures with Discrete Heat Sources, IEEE Transactions on Components Packaging & Manufacturing Technology., 4 (2014), 5, pp. 817-830
  16. Chai, J., et al., An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits With Through-Silicon Vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (2019), 5, pp. 877-887
  17. Sivakumar, P., et al., Optimization of Thermal Aware Multilevel Routing for 3-D IC, Analog Integrated Circuits and Signal Processing, 103 (2020), Oct., pp. 131-142
  18. Li, Y. S., et al., Dynamic Thermal Management for 3-D IC With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (2019), 7, pp. 1244-1252
  19. Ladenheim, S., et al., The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 37 (2018), 12, pp. 3123-3136
  20. Alqahtani, A., et al., System-Level Analysis of 3-D IC with Thermal TSV, ACM Journal on Emerging Technologies in Computing Systems (JETC), 14 (2018), 3, pp. 1-16
  21. Zając, P., Napieralski, A., Novel Thermal Model of Microchannel Cooling System Designed for Fast Simulation of Liquid-Cooled IC, MicroelectronIC Reliability, 87, (2018), Aug., pp. 245-258
  22. Pi, Y., et al., Anisotropic Equivalent Thermal Conductivity Model for Efficient and Accurate Full-Chip-Scale Numerical Simulation of 3-D Stacked IC, International Journal of Heat and Mass Transfer, 120 (2018), May, pp. 361-378
  23. Lu, L. Y., Chiou, L. Y., Temperature gradient-Aware Thermal Simulator for 3-D Integrated Circuits, IET Computers & Digital Techniques, 11 (2017), 5, pp. 190-196
  24. Xiao, C., et al., An Effective and Efficient Numerical Method for Thermal Management in 3-D Stacked Integrated Circuits, Applied Thermal Engineering, 121 (2017), July, pp. 200-209
  25. Wang, K. J., et al., An Analytical Thermal Model for 3-D Integrated Circuits with Integrated Micro-Channel Cooling, Thermal Science, 21 (2017), 4, pp. 1601-1606
  26. Wang, K. J., Sun, H. C., A Micro-Channel Cooling Model For a 3-D Integrated Circuit Considering Through-silicon Vias, Micro And Nanosystems, 13 (2021), 1, pp. 49-54
  27. Chen, H. B., et al. H2-Matrix-Based Finite Element Linear Solver for Fast Transient Thermal Analysis of High-Performance IC, International Journal of Circuit Theory and Applications, 43 (2015), 12, pp. 1953-1970
  28. Nagata, M., Limitations, Innovaions, and Challenges of Circuits and Devices into a Half Micrometer and Beyond, IEEE Journal of Solid-State Circuits, 27 (1992), 4, pp. 465-472

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence