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Different stacked structures affect greatly the temperature distribution of a 3-D integrated circuit, and an optimal structure is much needed to reduce the maximal temperature. This paper suggests a numerical approach to such structures with different heat source distributions. The results show that an optimal stacked structure can reduce the maximum temperature by 8.7℃.
PAPER REVISED: 2020-06-20
PAPER ACCEPTED: 2020-06-20
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THERMAL SCIENCE YEAR 2021, VOLUME 25, ISSUE Issue 3, PAGES [2221 - 2225]
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© 2022 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence