THERMAL SCIENCE

International Scientific Journal

Authors of this Paper

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Kang-Jia Wang

,

Cui-Ling Li

THERMAL MANAGEMENT OF 3-D INTEGRATED CIRCUITS WITH SPECIAL STRUCTURES

ABSTRACT
Different stacked structures affect greatly the temperature distribution of a 3-D integrated circuit, and an optimal structure is much needed to reduce the maximal temperature. This paper suggests a numerical approach to such structures with different heat source distributions. The results show that an optimal stacked structure can reduce the maximum temperature by 8.7℃.
KEYWORDS
thermal, three-dimensional integrated circuit, thermal management，special structures
PAPER SUBMITTED: 2020-01-15
PAPER REVISED: 2020-06-20
PAPER ACCEPTED: 2020-06-20
PUBLISHED ONLINE: 2021-03-27
DOI REFERENCE: https://doi.org/10.2298/TSCI200115109W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2021, VOLUME 25, ISSUE Issue 3, PAGES [2221 - 2225]
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Thermal management of 3-D integrated circuits with special structures

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence