TY - JOUR
TI - Thermal management of 3-D integrated circuits with special structures
AU - Wang Kang-Jia
AU - Li Cui-Ling
JN - Thermal Science
PY - 2021
VL - 25
IS - 3
SP - 2221
EP - 2225
PT - Article
AB - Different stacked structures affect greatly the temperature distribution of a 3-D integrated circuit, and an optimal structure is much needed to reduce the maximal temperature. This paper suggests a numerical approach to such structures with different heat source distributions. The results show that an optimal stacked structure can reduce the maximum temperature by 8.7℃.