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Thermal model for three-dimensional integrated circuits with integrated MLGNR-based TSV

ABSTRACT
This paper applies the multi-layer graphene nanoribbon(MLGNR) as a new prospective filler material for through silicon via (TSV) to solve the complex heat problems in the three-dimensional integrated circuits(3D-ICs). An equivalent thermal model for 3D-ICs with the MLGNR-based TSV is presented in this work, which take lateral heat transfer of TSV into account. The experimental results show that the heat transfer performance of MLGNR-based TSV is better than the conventional Cu-based TSV. Furthermore, it is found that the temperature predicted by the proposed model are in good accordance with the ANSYS simulation, and the maximum relative deviation is less than 4.0%.
KEYWORDS
PAPER SUBMITTED: 2018-05-07
PAPER REVISED: 2018-10-24
PAPER ACCEPTED: 2018-11-18
PUBLISHED ONLINE: 2018-12-16
DOI REFERENCE: https://doi.org/10.2298/TSCI180507321X
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