THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

Authors of this Paper

External Links

Peng Xu

,

Huan Huang

,

Fa Zou

,

Chun Shan

online first only

A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of three-dimensional integrated circuits

ABSTRACT
This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSVs) and micro-channels to solve the complex heat problems of three-dimensional integrated circuits (3D-ICs). The COMSOL simulation model is established to investigate the characteristics of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., case 4: 3D-ICs with embedded both TSVs and micro-channels) can reduce steady-state temperature over 43.546%, 18.440% and 12.338% in comparison to case 1 (i.e., 3D-ICs without embedded heat dissipation structure), case 2 (i.e., 3D-ICs with only inserted TSVs) and case 3 (i.e., 3D-ICs with only embedded micro-channels), respectively. Besides, it is demonstrated that CNTs as filler material of TSVs and CNTs nanofluid as coolant of micro-channels (i.e., the proposed scheme 4) can further reduce steady-state temperature of 3D-ICs with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of scheme 4 is reduced by 13.767% as compared with scheme 1 (i.e., the conventional Cu as filler material of TSVs and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3D-ICs with embedded the proposed heat dissipation structure can be enhanced by the increase of TSVs radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3D-ICs.
KEYWORDS
three-dimensional integrated circuits, heat dissipation structure, heat transfer performance
PAPER SUBMITTED: 2024-06-10
PAPER REVISED: 2024-07-30
PAPER ACCEPTED: 2024-08-12
PUBLISHED ONLINE: 2024-08-31
DOI REFERENCE: https://doi.org/10.2298/TSCI240610202X
REFERENCES
  1. Che, F.X., et al., Reliability Study of 3D IC Packaging Based on Through-Silicon Interposer (TSI) and Silicon-Less Interconnection Technology (SLIT) Using Finite Element Analysis, Microelectron. Reliab., 61 (2016), pp. 64-70
  2. Xu, P., Pan, Z.-L., Thermal Model for 3-D Integrated Circuits with Integrated MLGNR-Based Through Silicon Via, Therm. Sci., 24 (2020), 3 Part B, pp. 2067-2075
  3. Coudrain, P., et al., Experimental Insights into Thermal Dissipation in TSV-Based 3-D Integrated Circuits, IEEE Des. Test, 33 (2016), 3, pp. 21-36
  4. Dhananjay, K., et al., Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects, IEEE Trans. Circuits Syst. II Express Briefs, 68 (2021), 3, pp. 837-843
  5. Ge, C., et al., Equivalent Thermal Conductivity Modeling of Through-Silicon Via (TSV) Structures, Proceedings, 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), Beijing, China, November 2018, pp. 164-165
  6. Savidis, I., et al., Electrical Modeling and Characterization of Through-Silicon Vias (TSVs) for 3-D Integrated Circuits, Microelectron. J., 41 (2010), 1, pp. 9-16
  7. Barua, A., et al., Thermal Management in 3-D Integrated Circuits with Graphene Heat Spreaders, Phys. Procedia, 25 (2012), pp. 311-316
  8. Liu, Z., et al., Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., 33 (2014), 10, pp. 1490-1502
  9. Rakesh, B., et al., Simplistic Approach to Reduce Thermal Issues in 3D IC Integration Technology, Mater. Today Proc., 45 (2021), pp. 1399-1402
  10. Zhao, Y., et al., TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing, Proceedings, 2018 28th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), Platja d'Aro, July 2018, pp. 155-162
  11. Salvi, S.S., Jain, A., A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs), IEEE Trans. Compon. Packag. Manuf. Technol., 11 (2021), 5, pp. 802-821
  12. Lau, J.H., Yue, T.G., Thermal Management of 3D IC Integration with TSV (Through Silicon Via), Proceedings, 2009 59th Electronic Components and Technology Conference, San Diego, CA, USA, May 2009, pp. 635-640
  13. Kandlikar, S.G., Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits, J. Electron. Packag., 136 (2014), 2, pp. 024001
  14. Huang, H., et al., The Integration of Double-Layer Triangular Micro-Channel in Three-Dimensional Integrated Circuits for Enhancing Heat Transfer Performance, Case Stud. Therm. Eng., 58 (2024), pp. 104363
  15. Kearney, D., et al., A Liquid Cooling Solution for Temperature Redistribution in 3D IC Architectures, Microelectron. J., 43 (2012), 9, pp. 602-610
  16. Islam, S., Motaleb, I.A., Investigation of the Dynamics of Liquid Cooling of 3D ICs, Proceedings, 2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China, October 2019, pp. 1-3
  17. Xiao, C., et al., An Effective and Efficient Numerical Method for Thermal Management in 3D Stacked Integrated Circuits, Appl. Therm. Eng., 121 (2017), pp. 200-209
  18. Hou, L., et al., A Novel Thermal-Aware Structure of TSV Cluster in 3D IC, Microelectron. Eng., 153 (2016), pp. 110-116
  19. Zajac, P., et al., On the Applicability of Single-layer Integrated Microchannel Cooling in 3D ICs, Proceedings, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Toulouse, April 2018, pp. 1-6
  20. Ali, W.A.F.W., et al., Numerical Study of Laminar Flow in Pillared-micro Channel, Proceedings, 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), Batu Ferringhi, Penang, Malaysia, August 2017, pp. 71-74
  21. Song, D., et al., Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs, IEEE Trans. Compon. Packag. Manuf. Technol., 12 (2022), 3, pp. 537-543
  22. Narayan, V., Yao, S.-C., Modeling and Optimization of Micro-Channel Heat Sinks for the Cooling of 3D Stacked Integrated Circuits, Proceedings, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, Denver, Colorado, USA, January 1, 2011, pp. 999-1011
  23. Roy, S.K., et al., A Thermal Estimation Model for 3D IC Using Liquid Cooled Microchannels and Thermal TSVs, Proceedings, 2015 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Daejeon, South Korea, October 2015, pp. 122-127
  24. Hanhua Qian, et al., Thermal Simulator of 3D-IC with Modeling of Anisotropic TSV Conductance and Microchannel Entrance Effects, Proceedings, 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), Yokohama, January 2013, pp. 485-490
  25. Che, J., et al., Thermal Conductivity of Carbon Nanotubes, Nanotechnology, 11 (2000), 2, pp. 65-69
  26. Xia, G.D., et al., The Characteristics of Convective Heat Transfer in Microchannel Heat Sinks Using Al2O3 and TiO2 Nanofluids, Int. Commun. Heat Mass Transf., 76 (2016), pp. 256-264
  27. Lenin, R., et al., A Review of The Recent Progress on Thermal Conductivity of Nanofluid, J. Mol. Liq., 338 (2021), pp. 116929
  28. Ahmadi, M.H., et al., A Review of Thermal Conductivity of Various Nanofluids, J. Mol. Liq., 265 (2018), pp. 181-188
  29. Farsad, E., et al., Numerical Simulation of Heat Transfer in a Micro Channel Heat Sinks Using Nanofluids, Heat Mass Transf., 47 (2011), 4, pp. 479-490
  30. Mizunuma, H., et al., Thermal Modeling and Analysis for 3-D ICs with Integrated Microchannel Cooling, IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst., 30 (2011), 9, pp. 1293-1306
  31. Koo, J.-M., et al., Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures, J. Heat Transf., 127 (2005), 1, pp. 49-58
  32. Wang, K.-J., et al., An Analytical Thermal Model for Three-Dimensional Integrated Circuits With Integrated Micro-Channel Cooling, Therm. Sci., 21 (2017), 4, pp. 1601-1606
  33. Lienhard, J.H., Lienhard, J.H., A Heat Transfer Textbook, Dover Publications, Inc, Mineola, New York, 2019
  34. Sridhar, A., et al., 3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs, IEEE Trans. Comput., 63 (2014), 10, pp. 2576-2589
  35. Vajjha, R.S., et al., Measurements of Specific Heat and Density of Al2O3 Nanofluid, Proceedings, AIP Conference Proceedings, Bhubaneswar (India), 2008, pp. 361-370
  36. Simon, N., et al., Properties of Copper and Copper Alloys at Cryogenic Temperatures. Final report, Report No. PB-92-172766/XAB, NIST/MONO--177, 5340308, February 1, 1992
  37. Ho, C.Y., et al., Thermal Conductivity of The Elements, J. Phys. Chem. Ref. Data, 1 (1972), 2, pp. 279-421
  38. White, G.K., Collocott, S.J., Heat Capacity of Reference Materials: Cu and W, J. Phys. Chem. Ref. Data, 13 (1984), 4, pp. 1251-1257
  39. White, G.K., Minges, M.L., Thermophysical Properties of Some Key Solids: An Update, Int. J. Thermophys., 18 (1997), 5, pp. 1269-1327
  40. Xie, H., et al., Thermal Diffusivity and Conductivity of Multiwalled Carbon Nanotube Arrays, Phys. Lett. A, 369 (2007), 1-2, pp. 120-123
  41. Subramaniam, C., et al., One Hundred Fold Increase in Current Carrying Capacity in a Carbon Nanotube-Copper Composite, Nat. Commun., 4 (2013), 1, pp. 2202
  42. Azmi, W.H., et al., Correlations for Thermal Conductivity and Viscosity of Water Based Nanofluids, IOP Conf. Ser. Mater. Sci. Eng., 36 (2012), pp. 012029
  43. Xue, Q.Z., Model for Thermal Conductivity of Carbon Nanotube-Based Composites, Phys. B Condens. Matter, 368 (2005), 1-4, pp. 302-307
  44. Xuan, Y., Roetzel, W., Conceptions for Heat Transfer Correlation of Nanofluids, Int. J. Heat Mass Transf., 43 (2000), 19, pp. 3701-3707
  45. Pak, B.C., Cho, Y.I., Hydrodynamic and Heat Transfer Study of Dispersed Fluids with Submicron Metallic Oxide Particles, Exp. Heat Transf., 11 (1998), 2, pp. 151-170
  46. Bello-Ochende, T., et al., Constructal Cooling Channels for Micro-Channel Heat Sinks, Int. J. Heat Mass Transf., 50 (2007), 21-22, pp. 4141-4150
  47. Xu, P., et al., Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits, IEEE Access, 11 (2023), pp. 75285-75294
  48. Wang, K., Pan, Z., Thermal Management of the Die Bonding Architecture in 3D-Ics, Proceedings, Proceedings of the 3rd International Conference on Advances in Energy and Environmental Science 2015, Zhuhai, China, 2015
  49. Shiyanovskii, Y., et al., Analytical Modeling and Numerical Simulations of Temperature Field in TSV-based 3D ICs, Proceedings, International Symposium on Quality Electronic Design (ISQED), Santa Clara, CA, March 2013, pp. 24-29
  50. Yoshida, K., Morigami, H., Thermal Properties of Diamond/Copper Composite Material, Microelectron. Reliab., 44 (2004), 2, pp. 303-308
  51. Shoji, Y., et al., Cross-Linked Liquid Crystalline Polyimides with Siloxane Units: Their Morphology and Thermal Diffusivity, Macromolecules, 46 (2013), 3, pp. 747-755
  52. Sun, J., et al., Thermal Dissipation Performance of Metal-Polymer Composite Heat Exchanger with V-Shape Microgrooves: A Numerical and Experimental Study, Appl. Therm. Eng., 121 (2017), pp. 492-500
  53. Jumpholkul, C., et al., An Experimental Study to Determine the Maximum Efficiency Index in Turbulent Flow of SiO2/Water Nanofluids, Int. J. Heat Mass Transf., 112 (2017), pp. 1113-1121
  54. Jia, Y., et al., PSpice-COMSOL-Based 3-D Electrothermal-Mechanical Modeling of IGBT Power Module, IEEE J. Emerg. Sel. Top. Power Electron., 8 (2020), 4, pp. 4173-4185
PDF VERSION [DOWNLOAD]
A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of three-dimensional integrated circuits