THERMAL SCIENCE

International Scientific Journal

Authors of this Paper

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Wenhao Ding

,

Peng Yang

,

Pengfan Chen

,

Yingwen Liu

PARAMETER ANALYSIS AND OPTIMIZATION OF A HEAT SINK FOR COOLING INTELLIGENT POWER MODULES BASED ON TAGUCHI METHOD

ABSTRACT
The stability of the intelligent power module has a very significant impact on the operation of the air conditioner. In this paper, a prototype experimental platform is built to verify the feasibility of the simulation results. Next, the thermal performance and flow characteristics of the heat sink are analyzed, including single-factor analysis and analysis of interactive effects. The results show that a smaller pipe diameter can reduce the maximum temperature of intelligent power modules, TIPM, but it will increase the pressure drop, ΔP, and entropy generation. The thickness of the heat sink plate and the height of the protruding table have an interactive effect on the TIPM. Then the sensitivity of the TIPM and pressure drop to different parameters was analyzed, and the contribution ratio of the pipe diameter to both the TIPM and pressure drop was the largest. Finally, the optimal combination of parameters was obtained to minimize both the TIPM and pressure drop. Compared with the original structure, the TIPM decreased by 3.98 K.
KEYWORDS
liquid cooling, Intelligent power module, heat sink, sensitivity analysis, Taguchi method
PAPER SUBMITTED: 2022-11-07
PAPER REVISED: 2023-02-03
PAPER ACCEPTED: 2023-02-06
PUBLISHED ONLINE: 2023-04-22
DOI REFERENCE: https://doi.org/10.2298/TSCI221107070D
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2023, VOLUME 27, ISSUE Issue 5, PAGES [4277 - 4290]
REFERENCES
  1. Wang, P., et al., Hybrid Solid-And Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices, IEEE Transactions on Components, Packaging and Manufacturing Technology, 3 (2012), 4, pp. 601-611
  2. Lostetter, A., et al., An Overview to Integrated Power Module Design for High Power Electronics Packaging, Microelectronics Reliability, 40 (2000), 3, pp. 365-379
  3. Choi, U.-M., et al., Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems, IEEE Transactions on Power Electronics, 30 (2014), 5, pp. 2517-2533
  4. Yuan, W., et al., Numerical Simulation of the Thermal Hydraulic Performance of a Plate Pin Fin Heat Sink, Applied Thermal Engineering, 48 (2012), Dec., pp. 81-88
  5. Han, C.-W., Jeong, S.-B., Evaluation of the Thermal Performance with Different Fin Shapes of The Air-Cooled Heat Sink for Power Electronic Applications, Journal of International Council on Electrical Engineering, 6 (2016), 1, pp. 17-25
  6. Rao, Z., Wang, S., A Review of Power Battery Thermal Energy Management, Renewable and Sustainable Energy Reviews, 15 (2011), 9, pp. 4554-4571
  7. Liu, C.-K., et al., Direct Liquid Cooling for IGBT Power Module, Proceedings, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, 2014, pp. 41-44
  8. Seokkan, K., et al., A Bioinspired, Low Pressure Drop Liquid Cooling System for High-Power IGBT Modules for EV/HEV Applications, International Journal of Thermal Sciences, 161 (2021), 106708
  9. Lu, J., et al., Investigation of a Rectangular Heat Pipe Radiator with Parallel Heat Flow Structure for Cooling High-Power IGBT Modules, International Journal of Thermal Sciences, 135 (2019), Jan., pp. 83-93
  10. Pan, M., Study of the Performance of an Integrated Liquid Cooling Heat Sink for High-Power IGBT, Applied Thermal Engineering, 190 (2021), 116827
  11. Natarajan, G., Bezama, R., Microjet Cooler with Distributed Returns, Heat Transfer Engineering, 28 (2007), 8-9, pp. 779-787
  12. Bhunia, A., Chen, C.-L.. Jet Impingement Cooling of an Inverter Module in the Harsh Environment of a Hybrid Vehicle, Heat Transfer Summer Conference, 47349 (2005), Jan., pp. 561-567
  13. Wang, Y., et al., Reliability Enhancement by Integrated Liquid Cooling in Power IGBT Modules for Hybrid and Electric Vehicles, Microelectronics Reliability, 54 (2014), 9-10, pp. 1911-1915
  14. Yang, P., et al., Investigation and Optimization of an Intelligent Power Module Heat Sink Using Response Surface Methodology, Case Studies in Thermal Engineering, 28 (2021), 101410
  15. Hu, W., Wei, C., Numerical Simulation and Optimization of Heat Dissipation Structure for High Power Insulated Gate Bipolar Transistor (IGBT), Journal of Physics: Conference Series, 2290 (2022), 012122
  16. Cheng, M., et al., The Analysis of Numerical Simulation about Thermal Management on Frequency Converter, IEEE Access, 7 (2019), Oct., pp. 145677-145684
  17. Deng, Y., Liu, J., Hybrid Liquid Metal-Water Cooling System for Heat Dissipation of High Power Density Microdevices, Heat and Mass Transfer, 46 (2010), 11, pp. 1327-1334
  18. Hayashi, Y., et al., Thermal Performance and Pressure Drop of Galinstan-Based Micro-Channel Heat-Sink for High Heat-Flux Thermal Management, International Conference on Nanochannels, Micro-Channels, and Minichannels, 56871 (2015), V001T07A012
  19. Yerasimou, Y., et al., Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (2020), 11, pp. 1849-1860
  20. Wang, P., et al., Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module, Journal of Electronic Packaging, 135 (2013), 2, 021001
  21. Gunes, S., et al., A Taguchi Approach for Optimization of Design Parameters in a Tube with Coiled Wire Inserts, Applied Thermal Engineering, 31 (2011), 14-15, pp. 2568-2577
  22. Yu, C.-L., et al., Parameters Optimization of a Parallel-Flow Heat Exchanger with a New Type of Anti-Vibration Baffle and Coiled Wire Using Taguchi Method, Journal of Zhejiang University-SCIENCE A, 19 (2018), 9, pp. 676-690
  23. Yakut, K., et al., Experimental Investigation of Thermal Resistance of a Heat Sink with Hexagonal Fins, Applied Thermal Engineering, 26 (2006), 17-18, pp. 2262-2271
  24. Yakut, K., et al., Optimum Design-Parameters of a Heat Exchanger Having Hexagonal Fins, Applied Energy, 83 (2006), 2, pp. 82-98
  25. Wang, H., et al., Parametric Study and Optimization of H-Type Finned Tube Heat Exchangers Using Taguchi Method, Applied Thermal Engineering, 103 (2016), June, pp. 128-138
  26. Yang, P., et al., Investigation and Optimization of Heat Transfer Performance of a Spirally Corrugated Tube Using the Taguchi Method, International Communications in Heat and Mass Transfer, 127 (2021), 105577
  27. Zhi, C., et al., Numerical Investigation of Slit fin at Different Reynolds Numbers: A Sensitivity Analysis And Optimization by Taguchi Methodology, International Communications in Heat and Mass Transfer, 138 (2022), 106393
  28. Du, T., et al., Parametric Optimization of Overlapped Helical Baffled Heat Exchangers by Taguchi Method, Applied Thermal Engineering, 85 (2015), June, pp. 334-339
  29. Kaluri, R. S., Basak, T., Analysis of Entropy Generation for Distributed Heating in Processing of Materials by Thermal Convection, International Journal of Heat and Mass Transfer, 54 (2011), 11
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Parameter analysis and optimization of a heat sink for cooling intelligent power modules based on Taguchi method

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence