THERMAL SCIENCE
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THERMAL SCIENCE
International Scientific Journal
[ keyword: 3-D IC ]
Papers published in THERMAL SCIENCE also containing keyword
3-D IC
An equivalent thermal conductivity model of through silicon via arrays for thermal analysis in 3-D integrated circuits
THERMAL SCIENCE, volume 28, Issue 5, YEAR 2024
all keywords related to this paper
3-D IC
,
ETC
,
thermal analysis
,
FEM