THERMAL SCIENCE
International Scientific Journal
HEAT DISSIPATION PERFORMANCE OF GROOVED-TYPE AND COPPER FOAM-TYPE VAPOR CHAMBERS
ABSTRACT
Both grooved-type and copper foam-type vapor chambers are explored and investigated. The overall performance of vapor chamber depends on both axial and spread thermal resistance mutually. The copper foam-type vapor chambers achieved the lowest axial thermal resistance less than 0.2 K/W. The grooved-type sample presented the lowest spread thermal resistance, indicating better temperature uniformity. The visual experiment demonstrated that the evaporating surface of the copper-foam vapor chamber was dominated by the thin film evaporation mechanism at low charging ratio while dominated by the pulsed pool boiling mechanism at large charging ratio. For the grooved-type vapor chamber, the pool boiling mode was observed at any charging ratio.
KEYWORDS
PAPER SUBMITTED: 2020-08-21
PAPER REVISED: 1970-01-01
PAPER ACCEPTED: 2020-12-20
PUBLISHED ONLINE: 2021-04-10
THERMAL SCIENCE YEAR
2022, VOLUME
26, ISSUE
Issue 2, PAGES [1357 - 1366]
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