THERMAL SCIENCE

International Scientific Journal

HEAT DISSIPATION PERFORMANCE OF GROOVED-TYPE AND COPPER FOAM-TYPE VAPOR CHAMBERS

ABSTRACT
Both grooved-type and copper foam-type vapor chambers are explored and investigated. The overall performance of vapor chamber depends on both axial and spread thermal resistance mutually. The copper foam-type vapor chambers achieved the lowest axial thermal resistance less than 0.2 K/W. The grooved-type sample presented the lowest spread thermal resistance, indicating better temperature uniformity. The visual experiment demonstrated that the evaporating surface of the copper-foam vapor chamber was dominated by the thin film evaporation mechanism at low charging ratio while dominated by the pulsed pool boiling mechanism at large charging ratio. For the grooved-type vapor chamber, the pool boiling mode was observed at any charging ratio.
KEYWORDS
PAPER SUBMITTED: 2020-08-21
PAPER REVISED: 1970-01-01
PAPER ACCEPTED: 2020-12-20
PUBLISHED ONLINE: 2021-04-10
DOI REFERENCE: https://doi.org/10.2298/TSCI200821141W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2022, VOLUME 26, ISSUE Issue 2, PAGES [1357 - 1366]
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© 2022 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence