TY - JOUR TI - Heat dissipation performance of grooved-type and copper foam-type vapor chambers AU - Wang Leiqing AU - Zhang Donghui AU - Chen Yi AU - Sun Lili AU - Mao Jijing JN - Thermal Science PY - 2022 VL - 26 IS - 2 SP - 1357 EP - 1366 PT - Article AB - Both grooved-type and copper foam-type vapor chambers are explored and investigated. The overall performance of vapor chamber depends on both axial and spread thermal resistance mutually. The copper foam-type vapor chambers achieved the lowest axial thermal resistance less than 0.2 K/W. The grooved-type sample presented the lowest spread thermal resistance, indicating better temperature uniformity. The visual experiment demonstrated that the evaporating surface of the copper-foam vapor chamber was dominated by the thin film evaporation mechanism at low charging ratio while dominated by the pulsed pool boiling mechanism at large charging ratio. For the grooved-type vapor chamber, the pool boiling mode was observed at any charging ratio.