THERMAL SCIENCE

International Scientific Journal

Yichi Zhang

,

Shinichi Saito

,

Yoshishige Tsuchiya

,

Yeliang Wang

THEORETICAL CALCULATION AND SIMULATION OF SURFACE-MODIFIED SCALABLE SILICON HEAT SINK FOR ELECTRONICS COOLING

ABSTRACT
A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estimation of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resistance of 6.84°C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.
KEYWORDS
silicon heat sinks, thermal resistance, surface modification
PAPER SUBMITTED: 2021-05-11
PAPER REVISED: 2021-07-10
PAPER ACCEPTED: 2021-07-13
PUBLISHED ONLINE: 2021-10-17
DOI REFERENCE: https://doi.org/10.2298/TSCI2106181Z
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2021, VOLUME 25, ISSUE Issue 6, PAGES [4181 - 4187]
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Theoretical calculation and simulation of surface-modified scalable silicon heat sink for electronics cooling

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence