TY - JOUR
TI - Theoretical calculation and simulation of surface-modified scalable silicon heat sink for electronics cooling
AU - Zhang Yichi
AU - Saito Shinichi
AU - Tsuchiya Yoshishige
AU - Wang Yeliang
JN - Thermal Science
PY - 2021
VL - 25
IS - 6
SP - 4181
EP - 4187
PT - Article
AB - A surface-modified scalable heat sink that can be fabricated by applying  silicon microfabrication technology has been proposed in this paper.  Theoretical estimation of the heat sink thermal resistance is based on the  heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of  structure with various total number of grooves on the surface of fins have  been investigated. Finite element analysis has been conducted by using  COMSOL Multiphysics where fluid dynamics and heat transfer are taken into  account. As a result, the lowest heat sinks thermal resistance of 6.84°C  per Watt is achieved for the structure with a larger fin area (13.1 cm2) and  a higher inlet air flow rate (4 m/s), suggesting an optimum fin area  depending on the air flow rate.