THERMAL SCIENCE

International Scientific Journal

Authors of this Paper

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Kang-Jia Wang

,

Hong-Chang Sun

,

Zhong-Liang Pan

AN ANALYTICAL THERMAL MODEL FOR THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH INTEGRATED MICRO-CHANNEL COOLING

ABSTRACT
An analytical thermal model is developed for N-diestacked chips with integrated microchannels cooling. The model is implemented with some mathematical software. Comparison of the temperature predicted by the proposed model with some CFD software numerical results shows excellent agreement, and the maximal relative error is less than 4.0%.
KEYWORDS
thermal, three-dimensional integrated circuit, microchannel
PAPER SUBMITTED: 2016-07-16
PAPER REVISED: 2016-08-23
PAPER ACCEPTED: 2016-10-26
PUBLISHED ONLINE: 2017-09-09
DOI REFERENCE: https://doi.org/10.2298/TSCI160716041W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2017, VOLUME 21, ISSUE Issue 4, PAGES [1601 - 1606]
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An analytical thermal model for three-dimensional integrated circuits with integrated micro-channel cooling

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence