THERMAL SCIENCE

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Kang-Jia Wang

,

Zhong-Liang Pan

INTEGRATED MICROCHANNEL COOLING IN A THREE DIMENSIONAL INTEGRATED CIRCUIT: A THERMAL MANAGEMENT

ABSTRACT
Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling.
KEYWORDS
thermal, three-dimensional integrated circuit, microchannel
PAPER SUBMITTED: 2015-12-10
PAPER REVISED: 2016-02-01
PAPER ACCEPTED: 2016-03-31
PUBLISHED ONLINE: 2016-08-13
DOI REFERENCE: https://doi.org/10.2298/TSCI1603899W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2016, VOLUME 20, ISSUE Issue 3, PAGES [899 - 902]
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Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence