TY - JOUR
TI - Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management
AU - Wang Kang-Jia
AU - Pan Zhong-Liang
JN - Thermal Science
PY - 2016
VL - 20
IS - 3
SP - 899
EP - 902
PT - Article
AB - Microchannel cooling is a promising technology for solving the  three-dimensional integrated circuit thermal problems. However, the  relationship between the microchannel cooling parameters and thermal behavior  of the three dimensional integrated circuit is complex and difficult to  understand. In this paper, we perform a detailed evaluation of the influence  of the microchannel structure and the parameters of the cooling liquid on  steady-state temperature profiles. The results presented in this paper are  expected to aid in the development of thermal design guidelines for three  dimensional integrated circuit with microchannel cooling.