THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

online first only

Numerical study of three dimensional microscale heat transfer of a thin diamond slab under fix and moving laser heating

ABSTRACT
Laser heating is one of the most practical operations in the field of solid circuit production and thin condensed film treatment. The correct prediction of the heat propagation and flux into the micro/nano thin slab under laser heating has high practical importance. Many theoretical and numerical investigations have been performed for analysis of micro/nano heat conduction based on one or two dimensional approximations. For moving laser heating of thin films, with asymmetric paths, the one or two dimensional analysis can't be applied. The most appropriate equation for micro/nano heat transfer is the Boltzmann transport equation which predicts the phonon transport, precisely. In the present work, the three dimensional microscale heat conduction of a diamond thin slab under fix or moving laser heating at very small time scales has been studied. Hence, the transient three dimensional integro-differential equation of phonon radiative transfer or EPRT has been derived from the Boltzmann equation transport and solved numerically to find the heat flux and temperature of thin slab. Regarding the boundary and interface scattering and the finite relaxation time in the EPRT, leads to more precise prediction than conventional Fourier law, especially for moving laser heating.
KEYWORDS
PAPER SUBMITTED: 2017-11-20
PAPER REVISED: 2018-02-22
PAPER ACCEPTED: 2018-02-26
PUBLISHED ONLINE: 2018-03-04
DOI REFERENCE: https://doi.org/10.2298/TSCI171120088D
REFERENCES
  1. Y.-X. Zhang, X.-P. Luo, H.-L. Yi, H.-P. Tan, Energy conserving dissipative particle dynamics study of phonon heat transport in thin films, International Journal of Heat and Mass Transfer, 97 (2016) 279-288.
  2. P.G. Slobodanka, Z.N. SoSkic, M.N. Popovic, Analysis of Photothermal Response of Thin Solid Films by Analogy with Passive Linear Electric Networks, Thermal Science, 13 (2009) 129-142.
  3. X.-J. Yang, D. Baleanu, Fractal Heat Conduction Problem Solved by Local Fractional variation Iteration Method, Thermal Science, 17 (2013) 625-628.
  4. H. Ya-Fen, L. Hai-Dong, C. Xue, Numerical simulation for thermal conductivity of nanograin within three dimensions, Thermal Science, Fist-Online (2017) 257-257.
  5. S. Bin Mansoor, B.S. Yilbas, Phonon radiative transport in silicon-aluminum thin films: Frequency dependent case, International Journal of Thermal Sciences, 57 (2012) 54-62.
  6. E. Walther, R. Bennacer, C.D. SA, Lattice Boltzmann Method and diffusion in Materials with Large Diffusivity Ratios, Thermal Science, 21 (2017) 1173-1182.
  7. M. Grujicic, G. Cao, B. Gersten, Atomic-scale computations of the lattice contribution to thermal conductivity of single-walled carbon nanotubes, Materials Science and Engineering: B, 107 (2004) 204-216.
  8. G. Chen, D. Borca-Tasciuc, R.G. Yang, Nanoscale heat transfer, Encyclopedia of Nanoscience and Nanotechnology, 7 (2004) 429-459.
  9. M. Cardona, R.K. Kremer, Temperature dependence of the electronic gaps of semiconductors, Thin Solid Films, 571, Part 3 (2014) 680-683.
  10. A. Majumdar, Microscale Heat Conduction in Dielectric Thin Films, Journal of Heat Transfer, 115 (1993) 7-16.
  11. A.A. Joshi, A. Majumdar, Transient ballistic and diffusive phonon heat transport in thin films, Applied Physics, 74 (1993) 31-39.
  12. A. Raisi, A.A. Rostami, Unsteady Heat Transport in Direction Perpendicular to a Double-Layer Thin-Film Structure, J. of Numerical Heat Transfer, 41 (2002) 373-390.
  13. R. Yang, G. Chen, L. M., Simulation of nanoscale multidimensional transient heat conduction problems using ballistic-diffusive equations and phonon Boltzmann equation, J. of Heat Transfer, 124 (2005) 298-306.
  14. N.W. Ashcroft, M.N. D., Solid State Physics Saunders1976.
  15. K. C., Introduction to Solid State Physics, 6th ed., Wiley1968.
  16. V.S. Arpachi, Conduction heat transfer, Addison-Wesley Publication Company 1966.