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INTEGRATED MICROCHANNEL COOLING IN A THREE DIMENSIONAL INTEGRATED CIRCUIT: A THERMAL MANAGEMENT

ABSTRACT
Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling.
KEYWORDS
PAPER SUBMITTED: 2015-12-10
PAPER REVISED: 2016-02-01
PAPER ACCEPTED: 2016-03-31
PUBLISHED ONLINE: 2016-08-13
DOI REFERENCE: https://doi.org/10.2298/TSCI1603899W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2016, VOLUME 20, ISSUE 3, PAGES [899 - 902]
REFERENCES
  1. Banerjee, K., et al., 3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-On-Chip Integration, Proc. IEEE, 89 (2001), 5, pp. 602-633
  2. Patti, R. S., Three-Dimensional Integrated Circuits and the Future of System On-Chip Designs, Proc. IEEE, 94 (2006), 6, pp. 1214-1224
  3. Banerjee, K., Mehrotra, A., Global (Interconnect) Warming, IEEE Circ Dev Mag, 17 (2001), 5, pp. 16-32
  4. Kim, Y. J., et al., Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits with Nonuni form Heat Flux, J. Heat Transfer, 132 (2010), 4, pp. 1009-1017
  5. Dang, B., et al., Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips, IEEE T Adv Packaging, 33 (2010), 1, pp. 79-87
  6. Zhu, Z. M., et al., An Analytical Thermal Model for 3D Integrated Circuit Considering through Silicon Via, Acta Physica Sinica, 60 (2011), 11, pp. 2509-2515
  7. Li, P., et al., IC Thermal Simulation and Modeling via Efficient Multigrid-Based Approaches, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst, 25 (2006), 9, pp. 1763-1776
  8. Nagata, M., Limitations, Innovations, and Challenges of Circuits and Devices into a Half Micrometer and Beyond, IEEE J Solid-St Circ, 27 (1992), 4, pp. 465-472
  9. Mizunuma, H., et al., Thermal Modeling and Analysis for 3D-ICs with Integrated Microchannel Cooling, IEEE T Comput Aid D, 30 (2011), 9, pp. 1293-1306
  10. Yu, W. J., et al., Fast 3-D Thermal Simulation for Integrated Circuits with Domain Decomposition Method, IEEE T Comput Aid D, 32 (2013), 12, pp. 2014-2018
  11. Sridhar, A., et al., 3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs, IEEE T Comput, 63 (2014), 10, pp. 2576-2589

© 2020 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence