THERMAL SCIENCE

International Scientific Journal

ANALYTICAL THERMAL MODELLING OF MULTILAYERED ACTIVE EMBEDDED CHIPS INTO HIGH DENSITY ELECTRONIC BOARD

ABSTRACT
The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.
KEYWORDS
PAPER SUBMITTED: 2012-08-26
PAPER REVISED: 2013-05-25
PAPER ACCEPTED: 2013-05-25
PUBLISHED ONLINE: 2013-06-16
DOI REFERENCE: https://doi.org/10.2298/TSCI120826072M
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2013, VOLUME 17, ISSUE 3, PAGES [695 - 706]
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