THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

online first only

Thermal studies on heat sinks exposed to solar irradiation

ABSTRACT
The effect of solar irradiation on the temperature of an electronic device attached to a heat sink is studied. Heat sinks with different surface treatments are considered for this study. The contribution of absorbed solar heat by the Alumina coated fin surface varies from 2.1 % to 12.4 % of the heat generated by the electronic devices and it reveals that the amount of solar heat absorbed by the black painted heat sink is almost equal to the heat generated by the electronics system. It is also found that the percentage of heat transfer by radiation varies from 6.2 % to 11.0 % for commercial finish heat sinks and is as high as 58.7% for a black painted heat sink. The combined effect of emissivity and solar absorptivity is studied to optimize the heat sink. For 10 mm fin height, the black painted heat sink illustrates better performance and for 20 mm and 30 mm fin height, the Alumina coated heat sink exhibits better performance. The temperature of the electronic device increases when the base area of the heat sink is increased beyond 700 cm2, which is the optimum base area. When the fin height is increased to 20 mm, the optimum base area for the black painted and Alumina coated heat sink is also increased to 780 cm2 and 850 cm2 respectively, thus reducing the device temperature further. The CFD results are validated with the temperature measurement conducted on the heat sink exposed to solar irradiation.
KEYWORDS
PAPER SUBMITTED: 2023-01-10
PAPER REVISED: 2023-02-24
PAPER ACCEPTED: 2023-03-07
PUBLISHED ONLINE: 2023-04-22
DOI REFERENCE: https://doi.org/10.2298/TSCI230110081G
REFERENCES
  1. Agam Shah, "5G Unleashes the Future", ASME Mechanical Engineering, February 2019, 141(02): PP. 34-39.
  2. Chen Z., Li Y., Zhou W. and Yan Y, "Design and Simulation of the Thermal Management System for 5G Mobile Phones", Advances in Heat Transfer and Thermal Engineering, 2021, Springer, Singapore. doi.org/10.1007/978-981-33-4765-6_97
  3. Y. Shang, H. Xu, J. Mo, Z. Wang, X. Xu, Z. Tu, X. Zhang, H. Zheng, W. Chen, and F. Yu, "The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multi harmonic Matching", Active and Passive Electronic Components, Hindawi Publishing Corporation, Volume 2016, 7 pages.
  4. Gordon N. Ellison, "Maximum Thermal Spreading Resistance for Rectangular Sources and Plates With non-unity Aspect Ratios" IEEE Transactions on Components and Packaging Technologies, VOL. 26, No. 2, June 2003, PP. 439-454
  5. Luke Maguire, Masud Behnia and Graham Morrison, "Systematic evaluation of thermal interface materials—a case study in high power amplifier design", Microelectronics Reliability, 2005 (45), PP. 711-725
  6. Xiaojian Wang, Xiaohu Niu, Xiaoxue Wang, Xiaowei Qiu and Liangbi Wang, "Effects of filler distribution and interface thermal resistance on the thermal conductivity of composites filling with complex-shaped fillers", International Journal of Thermal Sciences, 2021, vol. 160, 106678,
  7. Allan D. Kraus, Abdul Aziz and James Welty, "Extended surface heat transfer", John Wiley & Sons Inc, USA, 2001, Chapter 13, pp. 572-635.
  8. Seri Lee, "Optimum Design and Selection Of Heat sinks" Eleventh IEEE SEMI-THERM Symposium, 1995, PP 48-54
  9. Avram Bar-Cohen, Madhusudan Iyengar and Allan D. Kraus, "Design of Optimum Plate-Fin Natural Convective Heat Sinks", Journal of Electronic Packaging June 2003, vol. 125, pp 208-216
  10. Hung-Jyun Liou, Shwin-Chung Wong, Yi-Cheng Lin, "Revisit on the natural convection from horizontal multi-channel rectangular-fin heat sinks", International Journal of Thermal Sciences, 2022, Vol. 171, 107232.
  11. V. Rammohan Rao, S.P. Venkateshan, "Experimental study of free convection and radiation in horizontal fin arrays", International Journal of Heat and Mass Transfer, 1996, vol.39, Issue 4, pp. 779-789.
  12. V. Dharma Rao, S V Naidu, B. Govinda Rao and K V Sharma, "Heat transfer from a horizontal fin array by natural convection and radiation - A conjugate analysis", International journal of heat and mass transfer, 2006, vol.49, pp.3379-3391.
  13. Frank Fan Wang, "Electronics packaging simplified radiation heat transfer analysis method", Inter society conference on thermal phenomena, 2004, pp.613-617
  14. Seung-Hwan Yu, Daeseok Jang, Kwan-Soo Lee, "Effect of radiation in a radial heat sink under natural convection", International Journal of Heat and Mass Transfer, 2012, vol. 55, pp. 505-509.
  15. Linjuan Huang, Yuchou Shih and Frank Shi, "Cooling strategy for LED filament bulb utilizing thermal radiation cooling and open slots enhancing thermal convection', 16th IEEE ITHERM conference, 2017, pp.1030-1033.
  16. Zhang, Z., Collins, M., Lau, E., Botting, C., and Bahrami, M. "The Role of Anodization in Naturally Cooled Heat Sinks for Power Electronic Devices." ASME. J. Heat Transfer, 2020, No.142(5): 052901.
  17. Hongye Zu, Wei Dai, Yong Li, Ke Li and Jiangtao Li, "Analysis of enhanced heat transfer on a passive heat sink with high-emissivity coating", International Journal of Thermal Sciences, 2021, Vol. 166, 106971.
  18. Dhanushkodi Ganesan and Velraj Ramalingam, "Effect of Solar Irradiation on Thermal Performance of Heat sink - Numerical and Experimental Study," IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Vol.11, No.9, doi: 10.1109/TCPMT.2021.3105256
  19. IEEE Std C37.24™-2017, IEEE Guide for Evaluating the Effect of Solar Radiation on Outdoor Metal-Enclosed Switchgear, 2017
  20. S. W. Churchill, and H.H.S. Chu, "Correlating Equations for Laminar and Turbulent Free Convection from a Vertical Plate", International Journal of Heat and Mass Transfer, 1975, vol.18, PP. 1323-1329
  21. Riyad Mubarak, Holger Schilke, and Gunther Seckmeyer, "Improving the Irradiance Data Measured by Silicon-Based Sensors", Energies 2021, 14, 2766.