Thermal Science - scientific journal [ keyword: thermal through silicon via ]

THERMAL SCIENCE

International Scientific Journal

[ keyword: thermal through silicon via ]

Papers published in THERMAL SCIENCE also containing keyword thermal through silicon via

Optimized method for thermal through silicon via placement with non-uniform heat sources in 3-D-IC

THERMAL SCIENCE, volume 27, Issue 5, YEAR 2023

all keywords related to this paper

three-dimensional integrated circuit, non-uniform, optimized method, cost function, thermal through silicon via