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Micro-channel heat sink is an effective way to solve the heat dissipation problem of electronic devices because of its compact structure and outstanding heat dissipation ability. In order to obtain the high efficiency and low resistance micro-channel heat sink, a new structure of open rectangular micro-channel heat sink with pin fins was proposed to enhance heat transfer. The orthogonal test method was used to design the experiment, and the 3-D software SOLIDWORKS was used to establish 25 groups of open rectangular micro-channel heat sink with pin fins structure model which has different structural parameters. The numerical calculation was carried out with ANSYS FLUENT simulation software and the experimental values with the structural parameters of the micro-channel heat sink as variables were obtained. According to the simulated experimental values, the objective functions of thermal resistance and pumping power were constructed, and the agent model between objective functions and the optimization variables were established. The Pareto optimal solutions of objective functions were calculated by non-dominated sorting genetic algorithm, which was analyzed by k-means clustering analysis and five clustering points were obtained, and five clusters points were compared and verified by simulation. it was found that there was effective tradeoff points between the highest and lowest points of the five clustering which can make both the pumping power and thermal resistance within the optimal range, so as to obtain the optimal micro-channel heat sink.
PAPER REVISED: 2021-12-31
PAPER ACCEPTED: 2022-01-03
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THERMAL SCIENCE YEAR 2022, VOLUME 26, ISSUE Issue 4, PAGES [3653 - 3665]
  1. Banothu Rakesh,et al., Simplistic Approach to Reduce Thermal Issues in 3D IC Integration Technology, Materials Today:Proceedings, 45(2021), 2, pp.1399-1402.
  2. Bin Ding, et al., Coupling Management Optimization of Temperature and Thermal Stress Inside 3D-IC with Multi-cores and Various Power Density, International Communications in Heat and Mass Transfer, 120(2021), pp.105021.
  3. Bin Dingab, et al., A Novel Thermal Management Scheme for 3D-IC Chips with Multi-cores and High Power Density, Applied Thermal Engineering, 168(2020), pp.114832.
  4. Kang- Jia Wang, et al., Thermal Management of 3-D Integrated Circuits with Special Structures, Thermal Science, 25(2021), 3B, pp.2221-2225.
  5. Shi XiaJun, et al., Multi-objective Optimization on the Geometrical Parameters of a Nanofluid-cooled Rectangular Microchannel Heat Sink, Journal of Xi 'an Jiaotong University,52(2018), 5, PP.56-61.
  6. Salvi Swapnil S, et al., A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs), IEEE Transactions on Components, Packaging & Manufacturing Technology, 11(2021), 5, pp. 802-821.
  7. PeitaoYao, et al., Thermal Performance Analysis of Multi-objective Optimized Microchannels with Triangular Cavity and Rib Based on Field Synergy Principle, Case Studies in Thermal Engineering, 25(2021), pp.100963.
  8. Long Zeng, et al. Thermal and Flow Performance in Microchannel Heat Sink with Open-ring Pin Fins, International Journal of Mechanical Sciences, 200(2021), pp. 106445.
  9. Chai L, et al., Numerical Simulation of Fluid Flow and Heat Transfer in a Microchannel Heat Sink with Offset Fan-shaped Reentrant Cavities in Sidewall, International Communications in Heat and Mass Transfer, 38(2011), 5, pp.577-584.
  10. Xia GD, et al., Numerical Investigation of Thermal Enhancement in a Micro Heat Sink with Fan-shaped Reentrant Cavities and Internal Ribs, Applied Thermal Engineering, 58(2013), 1-2, pp.52-60.
  11. Fangjun Hong, et al., Three Dimensional Numerical Analyses and Optimization of Offset Strip-fin Microchannel Heat Sinks, International Communications in Heat and Mass Transfer, 36(2009), 7, pp.651-656.
  12. Yadav, Vikas, et al., Numerical Investigation of Heat Transfer in Extended Surface Microchannels, International Journal of Heat and Mass Transfer, 93(2016), pp.612-622.
  13. Prabhakar Bhandari, et al., Thermal Performance of Open Microchannel Heat Sink with Variable Pin Fin Height, International Journal of Thermal Sciences, 159(2021), pp.106609.
  14. Husain A, et al., Optimization of a Microchannel Heat Sink with Temperature Dependent Fluid Properties, Applied Thermal Engineering, 28(2008), 8, pp.1101-1107.
  15. Ahmed Mohammed Adham, et al., Optimization of Nanofluid-cooled Microchannel Heat Sink, Thermal science,20(2016),1,pp.109-118.
  16. Vinoth, et al., Numerical Study of Inlet Cross-section Effect on Oblique Finned Microchannel Heat sink, Thermal science,22(2018), 6, pp.2747-2757.
  17. Kulkarni K, et al., Multi-objective Optimization of a Double-layered Microchannel Heat Sink with Temperature-dependent Fluid Properties, Applied Thermal Engineering, 99(2016), 1, pp.262-272.
  18. Y.K. Prajapati, et al., Influence of Fin Height on Heat Transfer and Fluid Flow Characteristics of Rectangular Microchannel Heat Sink, International Journal of Heat & Mass Transfer, 137(2019), pp.1041-1052.
  19. Wang Jiang, et al., Structural Optimization of Microchannels Based on Multi-objective Genetic Algorithm, Journal of Chemical Engineering of Chinese Universities, 34(2020), 4, pp.1034-1043.

© 2023 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence