THERMAL SCIENCE
International Scientific Journal
GOOD CONGRUENCES ON WEAKLY AMPLE SEMIGROUPS
ABSTRACT
The concept of normal congruence on a weakly ample semigroup, S, is introduced and the maximum and minimum admissible congruences whose trace is the normal congruence, π, on a weakly ample semigroup, S, are characterized in this paper. Some results about congruences on ample semigroups are generalized to weakly ample semigroups.
KEYWORDS
PAPER SUBMITTED: 2020-04-20
PAPER REVISED: 2020-06-13
PAPER ACCEPTED: 2020-06-15
PUBLISHED ONLINE: 2021-01-31
THERMAL SCIENCE YEAR
2021, VOLUME
25, ISSUE
Issue 2, PAGES [1431 - 1436]
- Lawson, M. V., Ress Matrix Semigroups, Proc. Edinb. Math. Soc., 33 (1990), pp. 23-27
- El-qallali, A., Congruences on Ample Semigroup, Semigroup Forum, 99 (2019), 3, pp. 607-631
- Preston, G. B., Inverse Semigroup, London. Math. Soc., 29 (1954), pp. 396-403
- Howie J. M., The Maximum Idempotent-Separating Congruence on an Inverse Semigroup, Proc. Edinb. Math. Soc., 14 (1964), pp. 71-79
- Petrich, M., Congruences on Inverse Semigroups, Journal of Algebra, 55 (1978), pp. 231- 256
- Fountain, J. B., Adequate Semigroups, Proc. Edinb. Math. Soc., 22 (1979), pp. 113-125
- Fountain, J. B., et al., A Munn Type Representation for a Class of E-Semiadequate Semigroups, Journal of Algebra, 218 (1999), pp. 693-714
- Feng, Y. Y., et al., Semigroups of Stochastic Gradient Descent and Online Principal Component Analysis: Properties and Diffusion Approximations, Commun. Math. Sci., 16 (2018), 3. pp. 777-789
- Keyantuo, V., et al., A Gevrey Class Semigroup for a Thermoelastic Plate Model with a Fractional Laplacian: Between the Euler-Bernoulli and Kirchhoff models, Discrete and Continuous Dynamical Systems, 40 (2020), 5, pp. 2875-2889
- He, J. H., Fractal Calculus and Its Geometrical Explanation, Results in Physics, 10 (2018), Sept., pp. 272-276
- He, J. H., Ain, Q. T., New Promises and Future Challenges of Fractal Calculus: From Two-Scale Thermodynamics to Fractal Variational Principle, Thermal Science, 24 (2020), 2A, pp. 659-681