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NUMERICAL STUDY OF NATURAL CONVECTION IN AN ENCLOSURE WITH DISCRETE HEAT SOURCES ON ONE OF ITS VERTICAL WALLS

ABSTRACT
In this study, natural convection in a fluid-filled rectangular enclosure is analyzed using COMSOL© commercial software. The fluid in which natural convection takes place is a dielectric liquid called FC-75. Attached to one of the vertical walls of the enclosure is an array of rectangular protrusions, each representing computer chips mounted on a printed circuit board. The nominal power consumed by each chip is assumed to be 0.35, 1.07, 1.65, and 2.35 W. This corresponds exactly to the values used in the experiments, which were performed once by the author of this study. The results of the experiment and the numerical study are shown as Nusselt numbers vs. Rayleigh numbers, both being the most important dimensionless parameters of natural convection. A comparison of the results has shown that COM-SOL© can achieve reliable results in similar problems, eliminating the need to build expensive experimental set-ups and spending time conducting experiments. The simulation results are aimed to be used in similar designs of electronic circuits in confined spaces.
KEYWORDS
PAPER SUBMITTED: 2019-08-16
PAPER REVISED: 2019-10-25
PAPER ACCEPTED: 2019-11-08
PUBLISHED ONLINE: 2019-12-22
DOI REFERENCE: https://doi.org/10.2298/TSCI190816448P
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2021, VOLUME 25, ISSUE Issue 1, PAGES [267 - 277]
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© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence