THERMAL SCIENCE

International Scientific Journal

Qing-Ju Tang

,

Shuai-Shuai Gao

,

Yong-Jie Liu

,

Yun-Ze Wang

,

Jing-Min Dai

THEORETICAL STUDY ON INFRARED THERMAL WAVE IMAGING DETECTION OF SEMICONDUCTOR SILICON WAFERS WITH MICRO-CRACK DEFECTS

ABSTRACT
The semiconductor silicon wafer with micro-crack defects was detected using infrared thermal wave imaging technique. The 3-D thermal conduction model in semiconductor silicon wafer excited by linear frequency modulated continuous laser was established, and it was solved by finite element method. The results show the effectiveness of the proposed method for detecting micro-crack defects in semi­conductor silicon wafers.
KEYWORDS
infrared thermal wave imaging technique, Micro-crack, semiconductor silicon wafer, Infrared thermal imaging, linear frequency, finite element method
PAPER SUBMITTED: 2020-06-01
PAPER REVISED: 2020-07-01
PAPER ACCEPTED: 2020-07-10
PUBLISHED ONLINE: 2020-11-27
DOI REFERENCE: https://doi.org/10.2298/TSCI2006011T
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2020, VOLUME 24, ISSUE Issue 6, PAGES [4011 - 4017]
REFERENCES
  1. Canale, J. E., et al., Glass Wafers for Semiconductors Fabrication Processes and Methods of Making Same, Life Sciences, 9 (2015), pp, 989-1001
  2. Guo, X., et al., Molecular Dynamics Study on the Thickness of Damage Layer in Multiple Grinding of Monocrystalline Silicon, Materials Science in Semiconductor Processing, 51 (2016), Aug., pp, 15-19
  3. Liu, T., et al., Subsurface Crack Damage in Silicon Wafers Induced ny Resin Bonded Diamond Wire Sawing, Materials Science in Semiconductor Processing, 57 (2017), C, pp, 147-156
  4. Woo, T. K., et al., Three-Dimensional Dual-Porous Structure Developed by Preferential/Stain Etching on Grind-Damaged (001) Si: Formation and Optical Properties, Journal of the Electrochemical Society, 159 (2012), 1, pp, P1-P7
  5. Abreu, L. A. S., et al., Thermography Detection of Contact Failures in Double Layered Materials using the Reciprocity Functional Approach, Applied Thermal Engineering, 100 (2016), May, pp, 1173-1178
  6. Kime, L., et al., High-Flux Monochromatic Ion and Electron Beams Based on Laser-Cooled Atoms, Physical Review A, 88 (2013), Sept., 033424
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Theoretical study on infrared thermal wave imaging detection of semiconductor silicon wafers with micro-crack defects

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence