TY - JOUR
TI - Theoretical study on infrared thermal wave imaging detection of semiconductor silicon wafers with micro-crack defects
AU - Tang Qing-Ju
AU - Gao Shuai-Shuai
AU - Liu Yong-Jie
AU - Wang Yun-Ze
AU - Dai Jing-Min
JN - Thermal Science
PY - 2020
VL - 24
IS - 6
SP - 4011
EP - 4017
PT - Article
AB - The semiconductor silicon wafer with micro-crack defects was detected using  infrared thermal wave imaging technique. The 3-D thermal conduction model  in semiconductor silicon wafer excited by linear frequency modulated  continuous laser was established, and it was solved by finite element  method. The results show the effectiveness of the proposed method for  detecting micro-crack defects in semi­conductor silicon wafers.