THERMAL SCIENCE

International Scientific Journal

External Links

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS

ABSTRACT
The through silicon via technology is a promising and preferred way to realize the reliable interconnection for 3-D integrated circuit integration. However, its size and the property of the filled-materials are two factors affecting the thermal behavior of the integrated circuits. In this paper, we design 3-D integrated circuits with different through silicon via models and analyze the effect of different material-filled through silicon vias, aspect ratio and thermal conductivity of the dielectric on the steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for through silicon vias in 3-D integrated circuits.
KEYWORDS
PAPER SUBMITTED: 2018-02-20
PAPER REVISED: 2018-11-25
PAPER ACCEPTED: 2018-11-26
PUBLISHED ONLINE: 2019-09-14
DOI REFERENCE: https://doi.org/10.2298/TSCI1904157W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2019, VOLUME 23, ISSUE Issue 4, PAGES [2157 - 2162]
REFERENCES
  1. Lu, T., et al., TSV-based 3D IC: Design Methods and Tools. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 36 (2017), 10, pp. 1593-1619
  2. Davis, W. R., et al. Demystifying 3D IC: the Pros and Cons of Going Vertical, IEEE Design & Test of Computers, 22 (2005), 6, pp. 498-510
  3. Wang, K. J., et al., Thermal Management of the hotspots in 3-D Integrated Circuits, Thermal Science, 22 (2018), 4, pp. 1685-1690
  4. Yan, H. X., et al., Thermal Aware Placement in 3D IC Using Quadratic Uniformity Modeling Approach, The VLSI Journal, 42 (2009), 2, pp. 175-180
  5. Wang, K. J., et al., Integrated Micro-Channel Cooling in a Three Dimensional Integrated Circuit: A Thermal Management, Thermal Science, 20 (2016), 3, pp. 899-902
  6. Sridhar, A., et al., 3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled IC, IEEE T Comput, 63 (2014), 10, pp. 2576-2589
  7. Wang, K. J., et al., An Analytical Model for Steady-State and Transient Temperature Fields in 3-D Inte-grated Circuits, IEEE Transactions on Components Packaging & Manufacturing Technology, 6 (2016), 7, pp. 1028-1041
  8. Feng, Z., Li, P., Fast Thermal Analysis on GPU for 3D IC With Integrated Microchannel Cooling, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 21 (2013), 8, pp. 1526-1539
  9. Wang, K. J., et al., An Analytical Thermal Model For Three-Dimensional Integrated Circuits With Inte-grated Micro-Channel Cooling, Thermal Science, 21 (2017), 4, pp. 1601-1606
  10. Patti, R. S., Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs, Proc. IEEE, 94 (2006), 6, pp. 1214-1224
  11. Wang, K. L., et al., A Modification of the Reduced Differential Transform Method for Fractional Calcu-lus, Thermal Science, 22 (2018), 4, pp. 1871-1875
  12. Kandlikar, S. G., Review and Projections of Integrated Cooling Systems for Three-Dimensional Inte-grated Circuits, Journal of Electronic Packaging, 136 (2014), 2, pp. 456-463
  13. Yoon, J. K., et al., Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits with Nonuniform Heat Flux, Journal of Heat Transfer, 132 (2010), 4, pp. 041009-041018
  14. Koo, J.-M., et al., Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architec-tures, J. Heat Transf., 127 (2005), 1, pp. 49-58
  15. Lin, S.-C. and Banerjee, K., Cool Chips: Opportunities and Implications for Power and Thermal Man-agement, IEEE Trans. Electron Devices, 55 (2008), 1, pp. 245-255
  16. Muzychka, Y. S., et al., Thermal Spreading Resistance and Heat Source Temperature in Compound Or-thotropic Systems with Interfacial Resistance, IEEE Trans. Compon., Packag., Manuf. Technol., 3 (2013) , 11, pp. 1826-1841
  17. Choobineh, L., Jain, A., Analytical Solution for Steady-State and Transient Temperature Fields in Verti-cally Stacked 3-D Integrated Circuits, IEEE Trans. Compon., Packag., Manuf. Technol., 2 (2012), 12, pp. 2031-2039
  18. Bagnall, K. R., et al., Analytical Solution for Temperature Rise in Complex Multilayer Structures with Discrete Heat Sources, IEEE Trans. Compon., Packag., Manuf. Technol., 4 (2014), 5, pp. 817-830
  19. Park M., et al., Evaluation of Si Liquid Cooling Structure with Microchannel and TSV for 3D Applica-tion, Microsystem Technologies, 23 (2017), 7, pp. 2609-2614
  20. Kim, D. H., et al., A Study of Through Silicon-Via Impact on the 3D Stacked IC Layout, IEEE Transac-tions on Very Large Scale Integration (VLSI) Systems, 21 (2013), 5, pp. 862-874
  21. Hsu, M.-K., et al., TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 32 (2011), 4, pp. 497-509
  22. Guiller, O., et al., Through Silicon Capacitor Co-Integrated with TSV on Silicon Interposer, Microelec-tronic Engineering, 120 (2014), May, pp. 121-126
  23. Khan, N. H., et al., Power Delivery Design for 3-D IC Using different Through-Silicon Via (TSV) Technologies, IEEE Trans. Very Large Scale Integr. (VLSI) Syst., 19 (2011), 4, pp. 647-658
  24. Nagata, M., Limitations, Innovaions, and Challenges of Circuits and Devices into a Half Micrometer and Beyond, IEEE J Solid-StCirc, 27 (1992), 4, pp. 465-472
  25. Sridhar, A., et al., 3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled IC, IEEE T Comput, 63 (2014), 10, pp. 2576-2589
  26. Liu, Y.-Q., et al., Nanoscale Multi-Phase Flow and Its Application to Control Nanofiber Diameter, Thermal Science, 22 (2018), 1A, pp. 43-46
  27. Tian, D., et al. Self-Assembly of Macromolecules in a Long and Narrow Tube, Thermal Science, 22 (2018), 4, pp. 1659-1664
  28. Tian, D., et al., Macromolecule Orientation in Nanofibers, Nanomaterials, 8 (2018), 11, ID 918
  29. Tian, D., et al., Macromolecular Electrospinning: Basic Concept & Preliminary Experiment, Results in Physics, 11 (2018), Dec., pp. 740-742

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence