THERMAL SCIENCE

International Scientific Journal

Chih-Neng Hsu

,

Yu-Hao Chang

,

Chang-Yuan Liu

,

Shih-Hao Fang

,

Chun-Chieh Huang

HEAT TRANSFER AND STRUCTURE STRESS ANALYSIS OF MICRO PACKAGING COMPONENT OF HIGH POWER LIGHT EMITTING DIODE

ABSTRACT
This paper focuses on the heat transfer and structural stress analysis of the micro- scale packaging structure of a high-power light emitting diode. The thermal-effect and thermal-stress of light emitting diode are determined numerically. Light emitting diode is attached to the silicon substrate through the wire bonding process by using epoxy as die bond material. The silicon substrate is etched with holes at the bottom and filled with high conductivity copper material. The chip temperature and structure stress increase with input power consumption. The micro light emitting diode is mounted on the heat sink to increase the heat dissipation performance, to decrease chip temperature, to enhance the material structure reliability and safety, and to avoid structure failure as well. This paper has successfully used the finite element method to the micro-scale light emitting diode heat transfer and stress concentration at the edges through etched holes.
KEYWORDS
heat transfer, structure stress, light emitting diode, micro packaging
PAPER SUBMITTED: 2013-01-18
PAPER REVISED: 2013-04-26
PAPER ACCEPTED: 2013-04-27
PUBLISHED ONLINE: 2013-12-28
DOI REFERENCE: https://doi.org/10.2298/TSCI1305277H
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2013, VOLUME 17, ISSUE Issue 5, PAGES [1277 - 1283]
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Heat transfer and structure stress analysis of micro packaging component of high power light emitting diode

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence