THERMAL SCIENCE

International Scientific Journal

Srinivas G. Bhatta

,

Seetharam T. Ramarao

,

Kankanhalli N. Seetharamu

NUMERICAL PREDICTION OF HEAT TRANSFER PHENOMENA FROM A CHIP ASSEMBLY FOR LOW REYNOLDS NUMBER

ABSTRACT
A three dimensional study of heat transfer from three heated blocks in a square channel at a Reynolds number of 108 with height of the chip assembly as the characteristic length is presented. Heated blocks affixed to the bottom plate represent electronic chips mounted on horizontal circuit board. A hexahedron block is affixed on to the top shrouding wall over the heated section. Thickness of this block is varied to study the effect on heat transfer from the chip assembly. A block of thickness equal to the passage between substrates produces maximum heat transfer enhancement. A block over the first passage enhances heat transfer from both immediate upstream and downstream chips considerably. A block over each recirculation zone produces moderate heat transfer from all the chips for a moderate pressure-drop. It is also observed that addition of blocks in the top plate does not add much to the pressure-drop in the duct.
KEYWORDS
Semiconductor device, Heat Transfer Enhancement, Hexahedron Blocks, low Reynolds number
PAPER SUBMITTED: 2009-05-14
PAPER REVISED: 2010-03-16
PAPER ACCEPTED: 2010-09-23
DOI REFERENCE: https://doi.org/10.2298/TSCI1102379B
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2011, VOLUME 15, ISSUE Issue 2, PAGES [379 - 388]
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Numerical prediction of heat transfer phenomena from a chip assembly for low Reynolds number

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence