International Scientific Journal

Thermal Science - Online First

Authors of this Paper

External Links

online first only

Optimization of a 3-D high-power LED lamp: Orthogonal experiment method and experimental verification

The temperature distribution in a 3-D high-power light emitting diode(LED)lamp is affect by multiple factors, the orthogonal experiment method is adopted to elucidate three main factors, an experiment is designed to verify the main finding, which is useful for an optimal design of the LED lamp.
PAPER REVISED: 2020-06-29
PAPER ACCEPTED: 2020-06-29
  1. Tsai M Y et al., Thermal resistance and reliability of high power LED packages under WHTOL and thermal shock tests. IEEE Transactions on Components and Packaging Technologies, 33 (2010), 4, 738-746
  2. Moo W S et al., Thermal analysis of high power LED packages under the alternating current operation, Solid State Electronics, 68 (2011), 48-50
  3. Abdelmlek K B, et a l Optimization of the thermal distribution of multi chip LED package. Applied Thermal Engineering, 126 2017 )), 653-660
  4. Fan , J. et al., Thermal/luminescence characterization and degradation mechanism analysis on phosphor converted white LED chip scale packages Microelectronics Reliability, 74 ( 2017), pp. 179-185
  5. Jian Q . et al., Analysis on thermal an d hydraulic performance of a T shaped vapor chamber designed for motorcycle led lights , Thermal Science 23 (2019), 1 pp. 137-148
  6. Mehm et , et al., Thermal analysis and optimization of high power led armature Thermal Science, 23 (2019), 2, pp. 637-640
  7. H uang, Y. B. et a l Radiant heat flux profile of horizontally oriented rectangular source fuel jet fires, Industrial & Engineering Chemistry Research, 57 (2018), 3, 1078-1088
  8. Tang , et al ., Thermal analysis of an LED module with a novelly assembled heat pipe heat sink , Journal of Central South University, 24 (2017), 4, pp 921-928
  9. Elger , G. et a l Transient thermal analysis for accelerated reliability testing of LEDs, Microelectronics Reliability, 64 (2016), 605-609
  10. Kudsi eh N et a l High power LED assemblies for solid state lighting Thermal analysis Optik, 126 (2015), pp. 3452-3456
  11. Bourim E M., et a l Electrical characterization and thermal admittance spectroscopy analysis of InGaN/GaN MQW blue LED structure, Electronic Materials Letters, 11 (2015), pp. 982-992
  12. Anithambigai , P. et a l Lacey .Synthesis and thermal analysis of aluminium nitride filled epoxy compo sites and its effective application as thermal interface material for LED applications Journal of Materials Science: Materials in Electronics, 25 (2014), 11, pp. 4814-4821
  13. Magnien J. et a l Parameter driven monitoring for a flip chip LED module under power cycling condition Microelectronics Reliability, 82 (2018), 84-89
  14. Huang Y et al ., Numerical analysis on the thermal performances of different types of fin heat sink for high power led lamp cooling , Thermal Science, 23 (2019), pp. 625-636
  15. Sök men , K F et al ., Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications , Applied Thermal Engineering, 94 (2016), pp. 534-542
  16. K im, L et al Thermal analysis of LED array system with heat pipe , Thermochimica Acta, 455 (2006) 1, pp. 21-25
  17. Qu an , J .., et al. Orthogonal test on local temperature influenced by different parameters and manipulation types of An pressing Xinshu (BL 15), Journal of Acupuncture and Tuina Science, 17 (2019), pp.147-154