International Scientific Journal


Continuous miniaturization of feature size, faster operation and high-end performance of processor are facing serious problems to dissipate heat. In this numerical work, the surface temperature of the processor, heat transfer rate, power consumption and reliability of channel heat sink for processor handling TiO2- -water and CuO-water nanofluids at three-volume fractions as a coolant are studied using CFD software package. The power dissipation of the Intel proces-sor was in the range of 16-135 W. The TiO2-water and CuO-water nanofluids at a volume fraction of 0.3%, 0.6%, and 0.9% was used as a coolant. It is observed that the heat transfer rate of CuO-water nanofluids at 0.3%, 0.6%, and 0.9% are 5%, 7%, and 9%, respectively, higher than that of TiO2-water nanofluid. It is found that the power consumption of the processor reduces by 2%, 3%, and 5% at the volume fraction of 0.3%, 0.6%, and 0.9%, respectively, than TiO2-water nanofluids as coolant. The failure rate of the processor using CuO-water nanofluid was found to be 17%, 10%, and 8% lesser than the TiO2-water nanofluids at the three-volume fractions, respectively.
PAPER REVISED: 2019-05-08
PAPER ACCEPTED: 2019-06-03
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  1. Choi, S.U.S., Eastman, J.A., Enhancing Thermal Conductivity Of Fluids With Nanoparticles, ASME International Mechanical Engineering Congress and Exposition, 66 (1995), 1,pp. 99-105
  2. Godwin Antony .A, et al. Analysis and optimization of performance parameters in computerized I.C. engine using diesel blended with linseed oil and leishmaan's solution, Mech. Mech. Eng. 21(2017), 2, pp. 193 205.
  3. Avudaiappan.T, et al. al., Potential Flow Simulation through Lagrangian Interpolation Meshless Method Coding, J. of Applied Fluid Mechanics, 11 ( 2018), Special Issue, pp. 129 -134.
  4. Koo, J., Kleinstreuer, C., A New Thermal Conductivity Model For Nanofluids, Journal of Nanoparticle Research, 6 (2004), 3, pp. 577-588.
  5. Kandlikar, S.G., et al., Heat Transfer And Fluid Flow In Minichannels And Microchannels, 2014
  6. Al-Rashed, M.H., et al., Investigation on The CPU Nanofluid Cooling, Microelectronics Reliability, 63 (2016), 1, pp.159-165.
  7. Ghasemi, S.E., et al., Numerical Study On Effect Of CuO-Water Nanofluid On Cooling Performance Of Two Different Cross-Sectional Heat Sinks, Advanced Powder Technology, 28 (2017), 2, pp. 1495-1504.
  8. Pradeep Mohan Kumar.K., .K., et al., , Computational Analysis and Optimization of Spiral Plate Heat Exchanger, J. of Applied Fluid Mechanics, Volume 11 (2018), Special Issue, Special Issue,, 121-128.
  9. Korpyś, M., et al., CPU Heat Sink Cooled By Nanofluids And Water: Experimental And Numerical Study, in: Computer Aided Chemical Engineering, 12 (2013), 2, pp.409-414.
  10. Jeng, L.Y., Teng, T.P., Performance Evaluation Of A Hybrid Cooling System For Electronic Chips, Experimental Thermal and Fluid Science, 45 (2013), 1, pp.155-162.
  11. Kumar.J.K, et al., Investigation of Performance and Emission Characteristics of Diesel Blends with Pine Oil, J. Appl. Fluid Mech., 11(2018), Special Issue, pp. 63-67.
  12. Vivekanandan. M et. al, Pressure Vessel Design using PV-ELITE Software with Manual Calculations and Validation by FEM, Journal of Engineering Technology, 8 (2019),1, pp.425-433.
  13. Shi, X., et al., Numerical Investigation Of Laminar Convective Heat Transfer And Pressure Drop Of Water-Based Al2O3 Nanofluids In A Microchannel, International Communications in Heat and Mass Transfer, 90 (2018), 1, pp.111-120.
  14. Saeed, M., Kim, M.H., Heat Transfer Enhancement Using Nanofluids (Al2O3-H2O) In Mini-Channel Heatsinks, International Journal of Heat and Mass Transfer,120 (2018), 1, pp.671-682.
  15. Ho, C.J., et al., Experimental Study Of Cooling Characteristics Of Water-Based Alumina Nanofluid In A Minichannel Heat Sink, Case Studies in Thermal Engineering,14 (2019), 1, pp. 6-10.
  16. Bakhti, F.Z., Si-Ameur, M., A Comparison Of Mixed Convective Heat Transfer Performance Of Nanofluids Cooled Heat Sink With Circular Perforated Pin Fin, Applied Thermal Engineering, 159 (2019), 1, pp. 1-6.
  17. Sohel Murshed, S.M., Nieto de Castro, C.A., A critical review of traditional and emerging techniques and fluids for electronics cooling, Renewable and Sustainable Energy Reviews, 78 (2017), 1, pp.821-833.
  18. Mukesh kumar,P.C., Arun kumar,C.M.,Influence of Aspect Ratio On Thermal Performance Of Heat sink Using ANSYS, Journal of Applied Fluid Mechanics, 19 (2018), Special issue, pp.45-52.
  19. Chandrasekar,M.,Mukesh kumar,P.C., Experimental Investigation on Heat Transfer and Pressure Drop in Double Helically Coiled Tube Heat Exchanger with MWCNT/Water Nanofluid, Journal of Applied Fluid Mechanics, 19 (2018), special issue, pp.23-29.
  20. Mukesh kumar,P.C.,Arun kumar,C.M., Numercial Study on Heat transfer Performance Using Al2O3/water nanofluids in Six Circular Channel Heatsink For Electronic Chip, Materials Today Proceedings-Journal Elsevier, (2019), pp.1-8.

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