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THERMAL MANAGEMENT OF ELECTRONICS: A REVIEW OF LITERATURE

ABSTRACT
Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .
KEYWORDS
PAPER SUBMITTED: 2007-04-09
PAPER REVISED: 2007-07-11
PAPER ACCEPTED: 2007-10-16
DOI REFERENCE: https://doi.org/10.2298/TSCI0802005A
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2008, VOLUME 12, ISSUE 2, PAGES [5 - 26]
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