ABSTRACT
Embedding microchannels in a 3D-IC can alleviate heat dissipation problems. In this paper, microchannel 3D-IC with alternating secondary flow channel was proposed and geometric parameters were optimized. Non-dominated Sorting Genetic Algorithm II was used for Pareto optimization. Optimization solutions (Rt_best, Pp_best and ψbest) were selected in Pareto front. The optimization objective values of these solutions are all less than the corresponding values of conventional design. Based on Pareto front, a compromise solution for Technique for Order Preference by Similarity to an Ideal Solution was calculated. Compared with conventional design, the thermal resistance of Rt_best, pumping power of Pp_best, and chip uniformity index of ψbest are reduced by 10.2%, 3.4% and 7.3%, respectively. Compared with conventional design, the thermal resistance, pumping power, and chip uniformity index of compromise solution based on Technique for Order Preference by Similarity to an Ideal Solution are reduced by 10.0%, 1.0% and 7.1%, respectively. The results may help the development of optimization design of the microchannel in 3D-IC.
KEYWORDS
PAPER SUBMITTED: 2024-10-05
PAPER REVISED: 2024-11-18
PAPER ACCEPTED: 2024-11-27
PUBLISHED ONLINE: 2025-01-09
- D. Zhou, Y. Chen, W. Gao, et al., A novel thermal management scheme of 3D-IC based on loop heat pipe, Int. J. Therm. Sci., 199 (2024), 108906
- U.K. Alugoju, S.K. Dubey, A. Javed, Optimization of converging and diverging microchannel heat sink for electronic chip cooling, IEEE Trans. Comp., Packag. Manufact. Technol., 10 (2020), 5, pp. 817-827
- L. Gong, Y. P. Xu, B. Ding, et al., Thermal management and structural parameters optimization of MCM-BGA 3D package model, Int. J. Therm. Sci., 147 (2020), pp. 106-120
- L. Ao, A. Ramiere, Through-chip microchannels for three-dimensional integrated circuits cooling, Therm. Sci. Eng. Prog., 47 (2024), 102333
- S.S. Salvi, A. Jain, A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs), IEEE Trans. Compon. Packag. Manuf. Technol., 11 (2021), 5, pp. 802-821
- T. Liu, M.T. Dunham, K.W. Jung, et al., Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution, Int. J. Heat Mass Transfer, 152 (2020), 119569
- D. Medhat, M. Dessouky, D. Khalil, A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection, Microelectron. Reliab., 124 (2021), 1, pp. 1-12
- S.J. Gräfner, J.H. Huang, V. Renganathan, et al., Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications, Chem. Eng. Sci., 269 (2023), 118474
- S. Kim, J. Seo, J. Choi, et al., Vertically Integrated Electronics: New Opportunities from Emerging Materials and Devices, Nano Micro Lett., 14 (2022), 201
- X. Zhang, Z. Ji, J. Wang, et al., Research progress on structural optimization design of microchannel heat sinks applied to electronic devices, Appl. Therm. Eng., 235 (2023), 121294
- Z.H. Wu, Z.Y. Jiang, W.J. Yan, et al., Jet microchannel with sawtooth wall for efficient cooling of high-power electronics, Int. J. Heat Mass Transfer, 206 (2023), 123955
- L. Zheng, Y. Zhang, G. Huang, et al., Novel electrical and fluidic microbumps for silicon interposer and 3D-ICs, IEEE Trans. Compon. Packag. Manuf. Technol., 4 (2014), 5, pp. 777-785
- E. Bayrak, A.B. Olcay, M.F. Serincan, Numerical investigation of the effects of geometric structure of microchannel heat sink on flow characteristics and heat transfer performance, Int. J. Therm. Sci., 135 (2019), pp. 589-600
- D.B. Tuckerman and R.F.W. Pease, High-performance heat sinking for VLSI, IEEE Electron Device Lett., 2 (1981), 5, pp. 126-129
- Z.Q. Lu, Z.H. Xie, K. Xi, et al., Constructal evolutionary design of liquid cooling heat sink embedded in 3D-IC based on deep neural network prediction, Int. Commun. Heat Mass Transfer, 152 (2024), 107273
- R. Wang, Z.H. Xie, Z.Q. Lu, Second law constructal designs of hybrid single-finned and stagger-finned microchannel heat sinks, J. Enhanced Heat Transfer, 29 (2022), 4, pp. 115-142
- W. He, Z.X. Wang, J.Q. Li, et al., Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips, Int. Commun. Heat Mass Transfer, 214 (2023), 124442
- Y.F. Yan, T. Zhao, Z.Q. He, Numerical investigation on the characteristics of flow and heat transfer enhancement by micro pin-fin array heat sink with fin-shaped strips, Chem. Eng. Process. Process Intensif., 160 (2021), 108273
- J. Zhang, H. Feng, L. Chen, et al., Constructal design of a rectangular parallel phase change microchannel in a three-dimensional electronic device, Sci. China Technol. Sci., 66 (2023), 12, pp. 3355-3368
- P. Zhang, D.W. Wang, W.S. Zhao, Investigation on Embedded Microchannel Heatsink for 2.5-D Integrated Package, IEEE Trans. Compon. Packag. Manuf. Technol., 13 (2023), 6, pp. 838-848
- B.H. Huang, C. Mi, L. Gong, et al., Thermal management for multi-cores chips through microchannels completely or incompletely filled with ribs, Case Stud. Therm. Eng., 54 (2024), 103977
- N.R. Kuppusamy, R. Saidur, N.N.N. Ghazali, et al., Numerical study of thermal enhancement in micro channel heat sink with secondary flow, Int. J. Heat Mass Transfer, 78 (2014), pp. 216-223
- A. Shakouri, Y. Zhang, On-chip solid-state cooling for integrated circuits using thinfilm microrefrigerators, IEEE Trans. Compon. Packag. Manuf. Technol., 28 (2005), 1, pp. 65-69
- N. Tran, Y.J. Chang, J.T. Teng, et al., Enhancement thermodynamic performance of microchannel heat sink by using a novel multi-nozzle structure, Int. J. Heat Mass Transfer, 101 (2016), pp. 656-666
- X.J. Shi, S. Li, Y.J. Mu, et al., Geometry parameters optimization for a microchannel heat sink with secondary flow channel, Int. Commun. Heat Mass Transfer, 104 (2019), pp. 89-100
- A.R. Gharaibeh, M.I. Tradat, S. Rangarajan, et al., Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics, Int. J. Heat Mass Transfer, 184 (2022), 122287
- C. Gao, X. Lan, Z. He, et al., Temperature uniformity analysis and multi-objective optimization of a small-scale variable density alternating obliquely truncated microchannel, Therm. Sci. Eng. Prog., 38 (2023), 101652
- F. Zhang, B. Wu, B. Du, Heat transfer optimization based on finned microchannel heat sink, Int. J. Therm. Sci., 172 (2022), 107357
- M. Pan, H. Wang, Y. Zhong, et al., Experimental investigation of the heat transfer performance of microchannel heat exchangers with fan-shaped cavities, Int. J. Heat Mass Tran., 134 (2019), pp. 1199-1208