THERMAL SCIENCE
International Scientific Journal
Thermal Science - Online First
online first only
Temperature fields analysis and heat dissipation structure design of an film capacitor in new energy vehicle
ABSTRACT
The high-temperature resistance performance of film capacitors in motor controllers faces greater challenges with the development of high voltage and high power density of new energy vehicles (NEVs). In this study, a typical film capacitor is taken as the object of research; simulations of temperature fields and experiments on temperature rises are conducted. Additionally, a heat dissipation structure is designed to enhance the high-temperature resistance performance of the capacitor. Firstly, the temperature field distributions of the capacitor under different ripple currents and ambient temperatures are analyzed using ANSYS electro-thermal coupling simulation. Then, under the same operating conditions, experiments on the temperature rises are conducted on the capacitor, which is installed with K-type thermocouples to verify the accuracy of the electro-thermal coupling simulation. Furthermore, an external heat dissipation structure consisting of a micro-channel liquid cold plate is designed for the capacitor, and the effectiveness of the external cold plate is verified through electro-thermal coupling and FLUENT simulations. It is found that under the operating conditions of 85 °C ambient temperature and 175 A ripple current, the maximum temperature of the capacitor with the external cold plates decreases by 46.08% compared to the original capacitor. The results indicate that the external cold plates effectively improve the high-temperature resistance capability of the film capacitors in electric vehicles.
KEYWORDS
PAPER SUBMITTED: 2024-06-27
PAPER REVISED: 2024-09-18
PAPER ACCEPTED: 2024-09-22
PUBLISHED ONLINE: 2024-11-09
- Kumar A, et al., Issues, challenges and future prospects of electric vehicles: A review, International Conference on Computing, Power and Communication Technologies. IEEE, 2018, pp. 1060-1065
- An, Z., et al., A review on lithium-ion power battery thermal management technologies and thermal safety, Journal of Thermal Science, 26 (2017), pp. 391-412
- Chen, Y., et al., A tutorial on high-density power module packaging, IEEE Journal of Emerging and Selected Topics in Power Electronics, 11 (2022), pp. 2469-2486
- Cittanti, D., et al., Analysis, design and experimental assessment of a high power density ceramic DC-link capacitor for a 800 V 550 kVA electric vehicle drive inverter, IEEE Transactions on Industry Applications, (2023), pp. 7078-7091
- Rąbkowski, Jacek, and Tadeusz Płatek., Comparison of the power losses in 1700V Si IGBT and SiC MOSFET modules including reverse conduction, 17th European Conference on Power Electronics and Applications, 2015, pp. 1-10
- Allca-Pekarovic, A., et al., Loss modeling and testing of 800 V DC bus IGBT and SiC traction inverter modules, IEEE Transactions on Transportation Electrification,10 (2024), pp. 2923-2935
- Flicker, J., et al., Lifetime testing of metallized thin film capacitors for inverter applications, 39th Photovoltaic Specialists Conference (PVSC), IEEE, 2013, pp. 3340-3342
- Wu, X., et al., Advanced dielectric polymers for energy storage, Energy Storage Materials,44 (2022), pp. 29-47
- Carter M A. Film capacitor for high temperature applications: U.S. Patent 6,687,115. 2004-2-3
- Zhou, M, et al., Combining high energy efficiency and fast charge-discharge capability in novel BaTiO3-based relaxor ferroelectric ceramic for energy-storage, Ceramics International,45(2019), pp. 3582-3590
- Yang, C., et al., Fatigue‐free and bending‐endurable flexible Mn‐doped Na0. 5Bi0. 5TiO3‐BaTiO3‐BiFeO3 film capacitor with an ultrahigh energy storage performance, Advanced Energy Materials,9 (2019), pp. 1803949
- Cui, Y, et al., Research on the influence of safety film on the thermal field distribution of metallized film capacitors, International Symposium on Insulation and Discharge Computation for Power Equipment, Singapore: Springer Nature Singapore, 2023, pp. 447-455
- Xu, S, et al., Strain engineering of energy storage performance in relaxor ferroelectric thin film capacitors, Advanced Theory and Simulations, 5 (2022), pp. 2100324
- Li, J, et al., Biaxially oriented films of grafted-polypropylene with giant energy density and high efficiency at 125° C, Journal of Materials Chemistry A,11 (2023), pp. 10659-10668
- Wu, C, et al., Flexible temperature‐invariant polymer dielectrics with large bandgap, Advanced Materials,32 (2020), pp.2000499
- MacDonald JR, et al., High energy density capacitors, IEEE Electrical Insulation Conference. IEEE, 2009, pp.306-309
- Zhang C, et al., Evolution characteristics of DC breakdown for biaxially oriented polypropylene films, IEEE Transactions on Dielectrics and Electrical Insulation,30 (2023), pp. 1188-1196
- Yao, R, et al., Lifetime analysis of metallized polypropylene capacitors in modular multilevel converter based on finite element method, IEEE Journal of Emerging and Selected Topics in Power Electronics, 9(2020), pp. 4248-4259
- Kong, Michael G., and Yuen-Pen Lee., Electrically induced heat dissipation in metallized film capacitors, IEEE transactions on dielectrics and electrical insulation, 11 (2004), pp. 1007-1013
- Reimers, J, et al., Automotive traction inverters: Current status and future trends, IEEE Transactions on Vehicular Technology, 68 (2019), pp.3337-3350
- Topolewski JN, et al., Cold plate with integrated DC link capacitor for cooling thereof: U.S. Patent 9,615,490. 2017-4-4
- Tai, Y, et al., Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity, Microelectronics Reliability, 137 (2022), pp. 114755
- Huang, L, et al., Numerical investigation and optimization on thermal management of a DC-bus film capacitor in electric vehicle using microchannel cooling plates, Applied Thermal Engineering, 244(2024), pp. 122695
- Zhen GONGa., et al., A study of the effects of the micro-channel cold plate on the cooling performance of battery thermal management systems, Thermal Science,26(2022) , pp.1503-1517
- Liu, WZ., et al., Microchannel topology optimization based on enhanced heat transfer mechanism, Thermal Science, 28(2024), pp.611-626