THERMAL SCIENCE

International Scientific Journal

Thermal Science - Online First

Huan Huang

,

Chun Shan

,

Futang Long

,

Zongjie Zeng

,

Lei Xie

,

Fa Zou

,

Peng Xu

online first only

The adoption of novel cooling liquids for enhancing heat transfer performance of three-dimensional integrated circuits with embedded micro-channel

ABSTRACT
The nanofluids (including MWCNT based nanofluid and SWCNT based nanofluid) and liquid metal Ga68In20Sn12 are proposed to replace the conventional water as cooling liquid of micro-channel for enhancing heat transfer performance of three-dimensional integrated circuits (3-D ICs) in this paper. An equivalent thermal model of 3-D ICs with integrated micro-channel is established to investigate the heat transfer performances for using different cooling liquids. The results show that the steady-state temperature for MWCNT based nanofluid, SWCNT based nanofluid and Ga68In20Sn12 as cooling liquids can be reduced over 25.698%, 28.771% and 35.735% than the conventional water scheme in a four-layers stacked chip, respectively. Besides, it is found that the steady-state temperature of all die layer in 3-D ICs can be further reduced by increasing the micro-channel size and flow velocity of cooling liquid. Therefore, the proposed novel materials (i.e., nanofluids and Ga68In20Sn12) as cooling liquids have excellent application prospect in solving thermal problems of 3-D ICs.
KEYWORDS
three dimensional integrated circuits, micro-channel, heattransfer performance
PAPER SUBMITTED: 2024-04-14
PAPER REVISED: 2024-05-20
PAPER ACCEPTED: 2024-05-26
PUBLISHED ONLINE: 2024-08-18
DOI REFERENCE: https://doi.org/10.2298/TSCI240414175H
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The adoption of novel cooling liquids for enhancing heat transfer performance of three-dimensional integrated circuits with embedded micro-channel