International Scientific Journal

Thermal Science - Online First

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Comparison of using air, CO2 and helium for the cooling of square-shaped electronic parts: CFD study with entropy generation analysis

Numerical simulation has been used in the current work to investigate improving the cool-down of electronic parts of cubical form involving dummy parts within a rectangular duct. Three working fluids (Air, CO2, and Helium) were used to cool 12 electrical chip arrays in the duct. The simulation investigates the effects of cooling fluid type and shifting hot element placements on whole cooling functioning at various Reynolds numbers. Also, the impact of the distance among electronic parts is researched. This is accomplished by moving the heat sources while leaving other components in their original positions as dummies to preserve the flow characteristics. The Reynolds number, Re, falls between (500 to 19000). The dimensionless entropy generation number reduces with the rise of the Re, while the pumping power ratio increases. It is determined that the dimensionless entropy generation computed for the case of constant viscosity of air yields slightly greater values than those obtained for the case of temperature-dependent viscosity. A high level of agreement in the experimental work is used to verify the standard k-model.
PAPER REVISED: 2024-01-24
PAPER ACCEPTED: 2024-01-27
  1. Farzaneh, M., et al., Design of Bifurcating Microchannels With/Without Loops for Cooling of Square-Shaped Electronic Components, Applied Thermal Engineering, 108 (2016), pp. 581-595, doi:10.1016/j.applthermaleng.2016.07.099
  2. Refaey, H. A., et al., Cooling Enhancement of Cubical Shapes Electronic Components Array Including Dummy Elements Inside a Rectangular Duct, Thermal Science, 27 (2022), 2B, pp. 1529-1538, doi:10.2298/tsci220523134r
  3. Refaey, H. A., et al., Numerical and Experimental Study for Heat Transfer Enhancement of Cubical Heat Source and Dummy Elements inside Rectangular Duct, Warme- und Stoffubertragung
  4. Bensafi, M., et al., Experimental Investigation of Cooling Performance in Electronic instruments, Thermal Science, 27 (2023), 4B, pp. 3445-3455
  5. Zhang, Y., et al., Theoretical Calculation and Simulation of Surface-Modified Scalable Silicon Heat Sink for Electronics Cooling, Thermal Science, 25 (2021), 6A, pp. 4181-4187, doi:10.2298/tsci2106181z
  6. Ma, Y., et al., Performance Study on a Printed Circuit Heat Exchanger Composed of Novel Airfoil Fins for Supercritical CO2 Cycle Cooling System, Thermal Science, 27 (2023), 1B, pp. 891-903, doi:10.2298/tsci220408112m
  7. Kumar, A., et al., Thermal Performance of Heat Sink Using Nano-Enhanced Phase Change Material (NePCM) for Cooling of Electronic Components, Microelectronics and Reliability, 121 (2021), p. 114144, doi:10.1016/j.microrel.2021.114144
  8. Tauseef-Ur-, R., and Ali, H. M., Experimental Study on the Thermal Behavior of RT-35HC Paraffin within Copper and Iron-Nickel Open Cell Foams: Energy Storage for Thermal Management of Electronics, International Journal of Heat and Mass Transfer, 146 (2020), p. 118852, doi:10.1016/j.ijheatmasstransfer.2019.118852
  9. Baby, R., and Balaji, C., Experimental Investigations on Phase Change Material Based Finned Heat Sinks for Electronic Equipment Cooling, International Journal of Heat and Mass Transfer, 55, (2012), 5-6, pp. 1642-1649, doi:10.1016/j.ijheatmasstransfer.2011.11.020
  10. Arshad, A., et al., Experimental Investigation of PCM Based Round Pin-Fin Heat Sinks for Thermal Management of Electronics: Effect of Pin Fin Diameter, Int. J. Heat Mass Transf, 117 (2018), pp. 861-872
  11. Behrooz, R., et al., Numerical Simulation of the Effect of Battery Distance and Inlet and Outlet Length on the Cooling of Cylindrical Lithium-Ion Batteries and Overall Performance of Thermal Management System, Journal of Energy Storage, 45 (2022), p. 103714, doi:10.1016/j.est.2021.103714
  12. Selvan, J., and Manavalla, S., Numerical Analysis of E-Machine Cooling Using Phase Change Material, Energies, 15 (2022), 15, p. 5594, doi:10.3390/en15155594.
  13. Bahiraei, M., and Heshmatian, S., Electronics Cooling with Nanofluids: A Critical Review, Energy Conversion and Management, 172 (2018), pp. 438-456, doi:10.1016/j.enconman.2018.07.047
  14. Bahiraei, M., and Monavari, A., Impact of Nanoparticle Shape on Thermohydraulic Performance of a Nanofluid in an Enhanced Microchannel Heat Sink for Utilization in Cooling of Electronic Components, Chinese Journal of Chemical Engineering, 40 (2021), pp. 36-47, doi:10.1016/j.cjche.2020.11.026
  15. Greiner, M., An Experimental Investigation of Resonant Heat Transfer Enhancement in Grooved Channels, International Journal of Heat and Mass Transfer, 34 (1991), 6, pp. 1383-1391, doi:10.1016/0017-9310(91)90282-j
  16. Alam, M. W., et al., CPU Heat Sink Cooling by Triangular Shape Micro-Pin-Fin: Numerical Study, International Communications in Heat and Mass Transfer, 112 (2020), p. 104455, doi:10.1016/j.icheatmasstransfer.2019.104455
  17. Ali, R. K., et al., Effect of Package Spacing on Convective Heat Transfer from Thermal Sources Mounted on a Horizontal Surface, Applied Thermal Engineering, 132 (2018), pp. 676-685, doi:10.1016/j.applthermaleng.2018.01.006
  18. Farhanieh, B., et al., Numerical and Experimental Analysis of Laminar Fluid Flow and Forced Convection Heat Transfer in a Grooved Duct, International Journal of Heat and Mass Transfer, 36 (1993), 6, pp. 1609-1617, doi:10.1016/s0017-9310(05)80070-5
  19. Asako, Y., and Faghri, M., Parametric Study of Turbulent Three-Dimensional Heat Transfer of Arrays of Heated Blocks Encountered in Electronic Equipment, International Journal of Heat and Mass Transfer, 37 (1994), 3, pp. 469-478, doi:10.1016/0017-9310(94)90081-7
  20. Molki, M., and Fagri, M., Temperature of In-Line Array of Electronic Components, Electron Cooling, 6 (2000), 2, pp. 26-32
  21. Nakayama, W., and Park, S. H., Conjugate Heat Transfer from a Single Surface-Mounted Block to Forced Convective Air Flow in a Channel, Journal of Heat Transfer, 118 (1996), 2, pp. 301-309, doi:10.1115/1.2825845
  22. Kurşun, B., and Sivrioğlu, M., Heat Transfer Enhancement Using U-Shaped Flow Routing Plates in Cooling Printed Circuit Boards, Journal of the Brazilian Society of Mechanical Sciences and Engineering, 40 (2018), 1, doi:10.1007/s40430-017-0937-z
  23. Bahiraei, M., et al., Employing Elliptical Pin-Fins and Nanofluid within a Heat Sink for Cooling of Electronic Chips Regarding Energy Efficiency Perspective, Applied Thermal Engineering, 183,(2021), p. 116159, doi:10.1016/j.applthermaleng.2020.116159
  24. Bahiraei, M., and Mazaheri, N., Application of an Ecofriendly Nanofluid Containing Graphene Nanoplatelets inside a Novel Spiral Liquid Block for Cooling of Electronic Processors, Energy (Oxford, England), 218 (2021), p. 119395, doi:10.1016/
  25. Bouzennada, T., et al., Numerical Simulation of Heat Transfer and Melting Process in a NEPCM: Using New Fin Shape, International Communications in Heat and Mass Transfer, 143 (2023), p. 106711, doi:10.1016/j.icheatmasstransfer.2023.106711
  26. Saeed, A. M., et al., A Numerical Investigation of a Heat Transfer Augmentation Finned Pear-Shaped Thermal Energy Storage System with Nano-Enhanced Phase Change Materials, Journal of Energy Storage, 53 (2022), p. 105172, doi:10.1016/j.est.2022.105172
  27. Mourad, A., et al., Numerical Investigation of a Snowflake-Shaped Fin-Assisted Latent Heat Storage System Using Nanofluid, Journal of Energy Storage, 55 (2022), p. 105775, doi:10.1016/j.est.2022.105775
  28. Belazreg, A., et al., Insight into Latent Heat Thermal Energy Storage: RT27 Phase Transition Material Conveying Copper Nanoparticles Experiencing Entropy Generation with Four Distinct Stepped Fin Surfaces, International Journal of Thermofluids, 19 (2023), p. 100368, doi:10.1016/j.ijft.2023.100368
  29. Mourad, A., et al., Numerical Study on N-Octadecane PCM Melting Process inside a Pear-Shaped Finned Container, Case Studies in Thermal Engineering, 38 (2022), p. 102328, doi:10.1016/j.csite.2022.102328
  30. Khaliq, A., Thermodynamic Optimization of Laminar Viscous Flow under Convective Heat Transfer through an Isothermal Walled Duct, Applied Energy, 78 (2004), pp. 289-304