ABSTRACT
Embedding micro-channels in a 3D-IC can alleviate heat dissipation problems. In this paper, micro-channel 3D-IC with alternating secondary flow channel was pro-posed and geometric parameters were optimized. Non-dominated Sorting Genetic Algorithm II was used for Pareto optimization. Optimization solutions (Rt_best, Pp_best, and ψbest) were selected in Pareto front. The optimization objective values of these solutions are all less than the corresponding values of conventional design. Based on Pareto front, a compromise solution for technique for order preference by similarity to an ideal solution was calculated. Compared with conventional design, the thermal resistance of Rt_best, pumping power of Pp_best, and chip uniformity index of ψbest are reduced by 10.2%, 3.4%, and 7.3%, respectively. Compared with conventional de-sign, the thermal resistance, pumping power, and chip uniformity index of compromise solution based on technique for order preference by similarity to an ideal solution are reduced by 10.0%, 1.0% and 7.1%, respectively. The results may help the development of optimization design of the micro-channel in 3D-IC.
KEYWORDS
PAPER SUBMITTED: 2024-10-05
PAPER REVISED: 2024-11-18
PAPER ACCEPTED: 2024-11-27
PUBLISHED ONLINE: 2025-01-09
THERMAL SCIENCE YEAR
2025, VOLUME
29, ISSUE
Issue 4, PAGES [2659 - 2670]
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