THERMAL SCIENCE

International Scientific Journal

THE EFFECT OF WATER’S PRESENCE AROUND THE PHASE CHANGE MATERIAL

ABSTRACT
As part of the research in the field of thermal control of electronic components, a phase change material is confined in a liquid and is heated vertically on one side by a hot plate. The presence of the liquid around the phase change material prevents the formation of air bubbles produced in case of direct contact between the hotplate and the phase change material (extends the lifetime of the phase change material by reducing overheating zones). It improves heat transfer by increasing the thermal conductivity around the phase change material (raising the thermal exchange surface) and by accelerating the convective transfer. This work examines experimentally and numerically the effect of the water on the phase change material and on the heating plate. The water is used around the phase change material and a comparative study of the comportment of some important parameters like the melt front form, melting time, flow direction, temperature, and operating time is realized. It is found that the presences of the liquid around the phase change material seems to be more interesting for a thermal protection role than the standard case of the phase change material directly heated by the hotplate.
KEYWORDS
PAPER SUBMITTED: 2018-09-22
PAPER REVISED: 2019-06-07
PAPER ACCEPTED: 2019-07-13
PUBLISHED ONLINE: 2019-08-10
DOI REFERENCE: https://doi.org/10.2298/TSCI180922301S
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2020, VOLUME 24, ISSUE Issue 6, PAGES [4049 - 4059]
REFERENCES
  1. Tilley, A.R.., H.D. Associates, The Measure of Man and Women, Human Factors in Design, Revised Edition, Whitney Library of Design, Watson Guptill Publications, (2001).
  2. V. Ebrahimian, et al, Two-dimensional modeling of water spray cooling in superheated steam, Thermal Science, 12 (2008) 79-88.
  3. Qiu, S., et al., Enhanced Heat Transfer Characteristics of Conjugated Air Jet Impingement on a Finned Heat Sink, Thermal Science, (2015).
  4. Bhattacharya, A., et al., Finned metal foam heat sinks for electronics cooling in forced convection, J. Elect. Package 124 (2002) 155-163.
  5. Tso, C. P., et al., Transient and cyclic effects on a PCM-cooled mobile device, Thermal Science 19 (5) (2015) pp. 1723-1731.
  6. Tan, F.L., et al., Cooling of mobile electronic devices using phase change materials. Applied Thermal Engineering 24 (2-3) (2004) 159-169.
  7. Kadri, S., et al., Large-scale experimental study of a phase change material: shape identification for the solid-liquid interface, Int. J. Thermophys 36 (2015) 2897-2915.
  8. Gharbi, S., et al., Experimental study of the cooling performance of phase change material with discrete heat sources - continuous and intermittent regimes, Appl. Therm. Eng. 111 (2017) 103-111.
  9. Ashraf, M. J., et al., Experimental passive electronics cooling: parametric investigation of pin-fin geometries and efficient phase change materials, International J. of Heat and Mass Transfer 115 (B) (2017) 251-263.
  10. Kandasamy, R., et al., Transient cooling of electronics using phase change material (pcm)-based heat sinks, Appl. Thermal Eng. 28 (2008) 1047-1057.
  11. Rudonja, N. R., et al., Heat Transfer Enhancement through PCM Thermal Storage by use of copper fins, Thermal Science, Vol. 20, Suppl. 1, (2016), S251-S259.
  12. Huang, M.J., et al., Thermal regulation of building-integrated photovoltaics using phase change materials, International Journal of Heat and Mass Transfer 47 (2004) 2715-2733.
  13. Huang, M.J., et al., Comparison of a small-scale 3D PCM thermal control model with a validated 2D PCM thermal control model, Solar Energy Materials & Solar Cells 90 (2006) 1961-1972.
  14. Yang, X.H., et al., Finned heat pipe assisted low melting point metal PCM heat sink against extremely high power thermal shock, Energy Convers Manage 160 (2018) 467-476.
  15. Salimpour, M.R., et al., Constructal multi-scale structure of PCM based heat sinks, Continuum Mechanics and Thermodynamics 29 (2017) 477-491.
  16. Srikanth, R., Experimental investigation on the heat transfer performance of a PCM based pin fin heat sink with discrete heating, Int. J. Therm. Sci. 111 (2017) 188-203
  17. Gharbi, S., et al., Experimental comparison between different configurations of PCM-based heat sinks for cooling electronic components, Applied Thermal Engineering 87 (2015) 454-462.
  18. Alshaer, W.G., et al., Thermal management of electronic devices using carbon foam and PCM/nano-composite, International Journal of Thermal Sciences 89 (2015) 79-86.
  19. Li, W.Q., et al., Enhanced thermal management with microencapsulated phase change material particles infiltrated in cellular metal foam, Energy 127 (2017) 671-679.
  20. Zheng, H., et al., Thermal performance of copper foam/ paraffin composite phase change material, Energy Convers Manage 157 (2018) 372-81.
  21. Huang, M.J., et al., Natural convection in an internally finned phase change material heat sink for the thermal management of photovoltaics, Solar Energy Materials & Solar Cells 95 (2011) 1598-1603.
  22. Vasu, A., et al., Corrosion effect of phase change materials in solar thermal energy storage application, Renew. Sustain. Energy Rev. 76 (2017) 19-33
  23. www.vedafrance.com.
  24. Brent, A.D., et al., Enthalpy-porosity technique for modeling convection-diffusion phase change: application to the melting of a pure metal, Numer. Heat Transfer 13 (1988) 297-318.
  25. Ogoh, W. and Groulx, D., Stefan's Problem: Validation of a One-Dimensional Solid-Liquid Phase Change Heat Transfer Process, Excerpt from the Proceedings of the COMSOL Conference Boston 2010.
  26. Heat Transfer Module, COMSOL MULTIPHYSICS, 2008.

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence