International Scientific Journal


High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multi-channel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.
PAPER REVISED: 2014-10-18
PAPER ACCEPTED: 2014-11-01
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THERMAL SCIENCE YEAR 2016, VOLUME 20, ISSUE Issue 6, PAGES [1991 - 2000]
  1. Mudawar I., Assessment of high-heat-flux thermal management schemes, IEEE, Componts and packaging technologies, 24(2001), 2, pp.122-141
  2. Ercan M., Dede, Optimization and design of a multipass branching microchannel heat sink for electronics cooling, Journal of electronic packaging, 134(2012), 12, pp.1-10
  3. T. Dang,J., T. Teng, Comparisons of the heat transfer and pressure drop of the microchannel and minichannel heat exchangers, Heat and Mass Transfer, 47(2011), 10,pp.1311-1322
  4. Anandakrishnan M., CFD Simulations of Thermal and Flow Fields inside a Desktop Personal Computer Cabin with Muti-core Processors, Engineering Applications of Computational Fluid Mechanics, 3(2009), 2, pp0277-288
  5. Hemanth B N, Balaji, Application of A CFD Approach to a System Level Thermal Simulation, International Journal of Heat and Technology, 25(2007), pp. 43-48
  6. G., Hetsroni, A., Mosyak, Z., Segal, Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels, IEEE Tran, Compon. Packag. Tech, 24 (2001), 1, pp.16-23
  7. Solovitz, S.,A., Mainka,J, Manifold Design for Micro-Channel Cooling With Uniform Flow Distribution, ASME Journal of Fluids Engineering, 133(2011), 051103, pp.1-11
  8. S. L. Xu, J. Qin, W. Guo, K. Fang, The design of an asymmetric bionic branching channel for electronic chips cooling, Heat and Mass Transfer, 49(2013), 6, pp.827-834
  9. P.-S. Lee, S. V. Garimella, D. Liu, Investigation of heat transfer in rectangular microchannels, Int. J. Heat Mass Transfer 48 (2005), pp.1688-170
  10. J. Zhang, Y.H. Diao, Y.H. Zhao, Y.N. Zhang, An experimental study of the characteristics of fluid flow and heat transfer in the multiport microchannel flat tube, Applied Thermal Engineering 65 (2014), pp. 209-218
  11. O. Mokrani, B. Bourouga, C. Castelain, H. Peerhossaini, Fluid flow and convective heat transfer in flat microchannels, Int. J. Heat Mass Transfer 52 (2009), pp.1337-1352
  12. Eric Monier-vinard,Najib Laraqi,Cheikh Tidiane Dia,Minh Nhat nguyen,Analytical thermal modelling of multilayered active embedded chips into high density electronic board, THERMAL SCIENCE,17(2013), 3,pp.695-706
  13. E.M. Dede, Y. Liu, Experimental and numerical investigation of a multi-pass branching microchannel heat sink, Applied Thermal Engineering 55 (2013), pp.51-60
  14. W. Habra, P. Tounsi, J.M. Dorkel., Transient Compact modeling for multi chips components, 11th International Workshop on THERMINIC, Belgirate, Italy, 2005, pp.28-30
  15. Göker Türkakar, Tuba Okutucu-Özyurt, Dimensional optimization of microchannel heat sinks with multiple heat sources. International Journal of Thermal Sciences, 62(2012), pp.85-92
  16. Tounsi P., Sauveplane J.B., Nowakowski J. P., Madrid F., Adaptive multiple cooling surfaces compact thermal model (CTM), and boundary condition Independent Multiple Heat Sources CTM, Proceedings, 25th IEEE SEMI-THERM Symposium, Washingtonz, USA, 2009, pp.232-238
  17. Zhangming Mao, Xiaobing Luo, Sheng Liu, Compact thermal model for microchannel substrate with high temperature uniformity subjected to multiple heat sources, Proceedings, 61th Electronic Components and Technology Conf., San Diego , USA, 2011, pp.1663-1672
  18. Eun Seok Cho, Jong Won Choi, Jae Sung Yoon, Min Soo Kim, Experimental study on microchannel heat sinks considering mass flow distribution with non-uniform heat flux conditions, International Journal of Heat and Mass Transfer, 53(2010), pp.2159-2168
  19. Kim S.Y., Hwang K., Moon J., S.W., Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot, Proceedings, 4th Assembly and Circuits Technology Conf., Beijing, China, 2009, pp.453-456
  20. Liu, S., Zhang, Y., Liu, P., Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips, Int. J. Heat Mass Transfer, 44(2007), 2, pp. 221-227

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