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EFFECTS OF PRESSURE AND TEMPERATURE ON THERMAL CONTACT RESISTANCE BETWEEN DIFFERENT MATERIALS

ABSTRACT
To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.
KEYWORDS
PAPER SUBMITTED: 2015-01-06
PAPER REVISED: 2015-05-05
PAPER ACCEPTED: 2015-05-12
PUBLISHED ONLINE: 2015-10-25
DOI REFERENCE: https://doi.org/10.2298/TSCI1504369Z
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2015, VOLUME 19, ISSUE Issue 4, PAGES [1369 - 1372]
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© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence