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Modern progress in electronics is associated with increase in computing ability and processing speed, as well as decrease in size. Future applications of electronic devices in aviation, aero space and high performance consumer products’ industry demand on very stringent specifications concerning miniaturization, component density, power density and reliability. Excess heat produces stresses on internal components inside the electronic device, thus creating reliability problems. Thus, a problem of heat generation and its efficient removal arises and it has led to the development of advanced thermal control systems. Present research analyses a thermodynamic feasibility of micro capillary heat pumped net works in thermal management of electronic systems, considers basic technological constrains and de sign availability, and identifies perspective directions for the further studies. Computer Fluid Dynamics studies have been per formed on the laminar convective heat transfer and pressure drop of working fluid in silicon micro channels. Surface roughness is simulated via regular constructal, and stochastic models. Three-dimensional numerical solution shows significant effects of surface roughness in terms of the rough element geometry such as height, size, spacing and the channel height on the velocity and pressure fields.
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  1. Park, K.A., Bergles, A.E., Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks, Proceedings, 8th International Heat Transfer Conference, August 17-22, 1986, vol. 4, pp. 2099-2104.
  2. Carvalho, R.D.M., Bergles, A.E., The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips, Proceedings, 9th International Heat Transfer Conference, August 19-22, 1990, pp. 289-294.
  3. Bergles, A.E., Bar-Cohen, A., Direct Liquid Cooling of Microelectronic Components, Advances in Thermal Modeling of Electronic Components and Systems, Eds., Bar-Cohen, A. and Kraus, A.D., Hemisphere Publishing Corp., vol. 2(1990), pp. 233-250.
  4. Incropera, F.P., Liquid Immersion Cooling of Electronic Components, Heat Transfer in Electronic and Microelectronic Equipment, Ed. A. E. Bergles, Hemisphere Publishing Corp., 1990, pp. 407-444.
  5. Bar-Cohen, A., Thermal Management of Electronic Components with Dielectric Liquids, International Journal of JSME, 36(1993), No. 1, pp. 1-25.
  6. Ma, C.F., Gan, Y.P., Tian, Y.C., Lei, D.H., Gomi, T., Liquid Jet Impingement Heat Transfer With or Without Boiling, Journal of Thermal Science, Vol. 2, Issue 1, 1993, pp. 32-49.
  7. Ravigururajan, T.S., Bergles, A.E., Visualization of Flow Phenomena Near Enhanced Surfaces, Journal of Heat Transfer, Vol. 116, Issue 1, 1994, pp. 54-57.
  8. Webb, R.L., Principles of Enhanced Heat Transfer, John Wiley & Sons, New York, NY, 1994.
  9. Nakayama, W., Daikoku, T., Kuwahara, H., Nakajima, T., Dynamic Model of Enhancement Boiling Heat Transfer on Porous Surfaces, Part I: Experimental Investigation, ASME Journal of Heat Transfer, Vol. 102, Issue 3, 1980, pp. 445-450.
  10. Amon, C.H., Murthy, J.Y., Yao, S.C., Narumanchi, S., Wu, C.F., Hsieh, C.C., MEMS Enabled Thermal Management of High-Heat-Flux Devices, Edifice: Embedded Droplet Impingement for Integrated Cooling of Electronics, Journal of Experimental Thermal and Fluid Science, vol. 25(2001), No. 5, pp. 231-242.
  11. Peterson, G.P., An Introduction to Heat Pipes, John Wiley & Sons, Inc., New York, 1994.
  12. Kosoy, B.V., Wick Pumping Technology, Proceedings, NATO ASI on Emerging Technologies and Techniques in Porous Media, Ovidius University Press, Constanta, Romania, 2003, pp.198-208.
  13. Kaviany, M., Principles of Heat Transfer in Porous Media, 2nd edition, Springer, 1999.
  14. Kosoy, B.V., The Feasibility and Design of High Pressure Wick Evaporators for Refrigeration Machines, Electronic CD Proceedings, International Congress of Refrigeration, Washington DC, August 17-22, 2003, ICR-204.
  15. Kosoy, B.V., Thermodynamic Concept of Capillary Pumped Refrigeration Loop, Proceedings, 5th International Seminar Heat Pipes, Heat Pumps, Refrigerators, Minsk, Belarus, September 8-11, 2003, pp.320-328.
  16. Kosoy, B.V., Passive Thermal Control in Refrigeration and Cooling, Proceedings, International Short Course on Passive Thermal Control, Beggel House, 22-24 October, 2003, pp.131-149.
  17. Shoji, S., Esashi, M., Matsuo, M., Prototype Miniature Blood Gas Analyzer Fabricated on a Silicon Wafer, Sensors Actuators, Vol.14, Issue 1, 1988, pp.101-107.
  18. Gravesen, P., Branebjerg, J., Jensen, O. S., Microfluidics, J. Micromech. Microeng., Vol. 3, 1993, Issue 1, pp.168-182.
  19. Takagi, H. et al., Phase Transformation Type Micro Pump, Proc. Int. Symp. on Micro Machine and Human Science, October 2-4, 1994, p.199-202.
  20. Ozaki, K., Pumping Mechanism Using Periodic Phase Changes of a Fluid, Proc. IEEE Micro Electro Mechanical Systems Workshop, Jan. 29 - Feb. 2, 1995, p.31-36.
  21. Kobayashi, Y., Heat Pipe Thermodynamic Cycle and Its Applications, ASME Journal of Solar Energy Engineering, Vol. 107, Issue 1, 1985, pp.153-159.
  22. Johnson, P. et al., Heat Pipe Turbine Becoming a Reality, Proceedings, 5th IHPS, November 17-20, 1996, pp.338-343.
  23. Scharff, P., New Carbon Materials for Research and Technology, Carbon, Vol. 36, Issue 4, 1998, pp.481-486.
  24. Cohen, M.L., Predicting New Materials and Their Properties, Solid Sate Communications, Vol. 107, 1998, pp.589-596.
  25. Hall, M., Wick Surface Modeling in Heat Pipes, Transactions of the 1991 American Nuclear Society Winter Meeting, November 10-15, 1991, p. 735.
  26. Ellison, G.N., Thermal Computations for Electronic Equipment, Robert E. Krieger Publishing Co., Malibar, Florida, 1989.
  27. Belady, C., Kelkar, K.M., Patankar, S.V., Improved Productivity with Use of Flow Network Modeling in Electronics Packaging, Electronics Cooling, Vol. 5, Issue 1, 1999, pp.36-40.
  28. Bejan, A., Constructal-Theory Network of Conducting Paths for Cooling a Heat Generating Volume, Int. J. Heat Mass Transfer, Vol.40, Issue 3, 1997, pp. 799-816.
  29. Bejan, A., Advanced Engineering Thermodynamics, 2nd edition, Wiley, New York, 1997.
  30. Bejan, A. et al., Porous and Complex Flow Structures in Modern Technologies, Springer, 2004.
  31. Kakac, S., Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Extended Abstracts, NATO ASI, July 18-30, 2004, Turkey.
  32. Patankar, S.V., Liu, C.H., and Sparrow, E.M. Fully Developed Flow and Heat Transfer in Ducts Having Streamwise- Periodic Variations of Cross Sectional Area, ASME J. Heat Transfer, Vol. 99, Issue 1, 1977, pp. 180-186.
  33. Smirnov, H.F., Reznikov, V.V., Thermophysical Problems of Electronic Equipment Cooling with the Refrigerating Evaporative Systems, Proceedings, Seminar on Heat and Mass Transfer in the Electronic Device Technologies, vol.1, September 3-9, 1989, pp. 10-22.
  34. Smirnov, H.F., Kosoy, B.V., Tkachenko, V.B., Heat pipe technology for refrigeration and cooling, keynote lecture #1, Proceedings, 12th International Heat Pipe Conference, Moscow, May 19-24, 2002, pp. 5-17.
  35. Mallik, A.K., Peterson, G.P., Weichold, M.H., On the use of Micro Heat Pipes as an integral Part of Semiconductor Devices, Journal of Electronic Packaging, Vol. 114, Issue 4, 1992, pp. 436-442.
  36. Peterson, G.P., Duncan, A.B., Weichold, M.H., Experimental Investigations of Micro Heat Pipes Fabricated in Silicon Wafers, Journal of Heat Transfer, Vol. 115, Issue 3, 1993, pp. 751-756.
  37. Cotter, T.P., Principles and prospects for Micro Heat Pipes, Proceedings, 5th International Heat Pipe conference, Tsukuba, Japan, May 14-17, 1984, pp. 328-335.
  38. Agoustini, B. et al., Liquid Flow Friction factor and heat Transfer Coefficient in Small Channels: an Experimental Investigation, Experimental Thermal and Fluid Science, Vol. 28, Issue 2, 2004, pp. 97-103.

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