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THERMAL BEHAVIOR OF ELECTROSPUN GELATIN AND CHITOSAN COMPLEX

ABSTRACT
This paper studied the thermal behavior of gelatin, chitosan, and their complex. Thermal stability was analyzed by thermogravimetric analysis, and the results showed that gelatin and chitosan raw materials exhibited two decomposition stages while as-electrospun nanofibrous mats had three decomposition stages. Moreover, chitosan raw material had better thermal stability than gelatin. However, its electrospun partner revealed its opposite trend. X-ray diffraction was used to analyze the crystalline property and the result showed that the crystallinity decreased due to the interaction with the solvents, and thus the thermal stability sharply decreased. In addition, incorporation of gelatin could improve the thermal stability of chitosan.
KEYWORDS
PAPER SUBMITTED: 2015-02-10
PAPER REVISED: 2015-04-21
PAPER ACCEPTED: 2015-05-22
PUBLISHED ONLINE: 2015-10-25
DOI REFERENCE: https://doi.org/10.2298/TSCI1504323Q
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2015, VOLUME 19, ISSUE 4, PAGES [1323 - 1326]
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© 2018 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence