THERMAL SCIENCE

International Scientific Journal

Tengqing Liu

,

Wentao Yan

,

Xin Yang

,

Shuangfeng Wang

THERMAL PERFORMANCE OF WICKLESS AND ORIENTATION INDEPENDENT THIN VAPOR CHAMBERS WITH WETTABILITY PATTERNED MICRO STRUCTURE

ABSTRACT
The wettability patterned micro structure (WPMS) arrays by laser etching are proposed to enhance the thermal performance of wickless thin vapor chamber (TVC). The effects of filling ratio and inclination angle on the thermal performance of wickless TVC with WPMS are investigated, and the untreated bare wickless TVC is also studied as comparison. The results show that the wickless TVC with WPMS can work stably at filling ratio ranging from 19.0% to 42.8%, and the optimum filling ratio is 42.8%. The maximum heat transfer capacity is 190 W with the lowest thermal resistance of 0.146 K/W. Since WPMS is superhydrophilic, it can provide nucleate sites to promote early onset nucleate boiling and capillary pressure to enhance the liquid supply. Thus, the wickless TVC with WPMS shows 10.98% lower thermal resistance and 18.75% higher maximum heat transfer capacity than that of the untreated bare wickless TVC. In addition, the thermal performance of wickless TVC with WPMS is insensitive to the orientation of the TVC.
KEYWORDS
Wickless thin vapor chamber, Wettability patterned micro structure, Laser etching, filling ratio, Orientation independent, thermal performance
PAPER SUBMITTED: 2021-11-06
PAPER REVISED: 2021-12-15
PAPER ACCEPTED: 2021-12-27
PUBLISHED ONLINE: 2022-02-05
DOI REFERENCE: https://doi.org/10.2298/TSCI211106017L
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2022, VOLUME 26, ISSUE Issue 5, PAGES [4391 - 4400]
REFERENCES
  1. Bulut, M., et al., A review of vapor chambers, Heat Transfer Engineering, 40 (2019), 19, pp. 1551-1573
  2. Xie, D., et al., Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review, International Journal of Heat and Mass Transfer, 175 (2021), 121132
  3. Mochizuki, M., et al., Review of various thin heat spreader vapor chamber designs, performance, lifetime reliability and application, Frontiers in Heat and Mass Transfer (FHMT), 13 (2019), 12
  4. Tang, H., et al., Review of applications and developments of ultra-thin micro heat pipes for electronic cooling, Applied energy, 223 (2018), pp. 383-400
  5. Gibbons, M. J., et al., A review of heat pipe technology for foldable electronic devices, Applied Thermal Engineering, 194 (2021), 117087
  6. Jafari, D., et al., Metal 3D-printed wick structures for heat pipe application: Capillary performance analysis, Applied thermal engineering, 143 (2018), pp. 403-414
  7. Wu, G. W., et al., Lamination and characterization of a PET flexible micro heat pipe, Proceedings, 10th International Heat Pipe Symposium, Taipei, Taiwan, 2011, pp. 80-85
  8. Xu, S., et al., Development of ultra-thin thermal ground planes by using stainless-steel mesh as wicking structure, Journal of Microelectromechanical Systems, 25 (2016), 5, pp. 842-844
  9. Shi, B., et al., Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber, Journal of Micromechanics and Microengineering, 29 (2019), 11, 115019
  10. Chen, Z., et al., Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices, Energy conversion and management, 187 (2019), pp. 221-231
  11. Huang, G., et al., A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices, Applied Thermal Engineering, 167 (2020), 114726
  12. Huang, G., et al., A new ultra-thin vapor chamber with composite wick for thin electronic products, International Journal of Thermal Sciences, 170 (2021), 107145
  13. Yu, J., et al., Effect of the passage area ratio of wick on an ultra-thin vapour chamber with a spiral woven mesh wick, Applied Thermal Engineering, 196 (2021), 117282
  14. Li, J., et al., Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips, Energy Conversion and Management, 201 (2019), 112202
  15. Lee, D., et al., Fabrication and characterization of pure-metal-based submillimeter-thick flexible flat heat pipe with innovative wick structures, International Journal of Heat and Mass Transfer, 122 (2018), pp. 306-314
  16. Zu, S., et al., Visualization study on boiling heat transfer of ultra-thin flat heat pipe with single layer wire mesh wick, International Journal of Heat and Mass Transfer, 173 (2021), 121239
  17. Kumar, N., et al., Design, fabrication, and performance evaluation of a novel orientation independent and wickless heat spreader, International Journal of Heat and Mass Transfer, 153 (2020), 119572
  18. Moon, J. H., et al., Boiling-driven, wickless, and orientation-independent thermal ground plane, International Journal of Heat and Mass Transfer, 167 (2021), 120817
PDF VERSION [DOWNLOAD]
Thermal performance of wickless and orientation independent thin vapor chambers with wettability patterned micro structure

© 2024 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence