TY - JOUR
TI - Thermal modeling and analysis of 3-D integrated circuits with irregular structure
AU - Rao Xixin
AU - Liu Huizhong
AU - Wang Sai
AU - Song Jianhao
AU - Jin Cheng
AU - Xiao Chengdi
JN - Thermal Science
PY - 2023
VL - 27
IS - 5
SP - 4193
EP - 4207
PT - Article
AB - Considering the manufacturing and packaging process, 3-D integrated circuits design often requires irregular chip structures. The 3-D integrated circuits with irregular structures can facilitate differentiated chip design and reduce manufac¬turing costs. Highly complex through-silicon vias have not been considered in past thermal modelling and analysis of irregularly structured 3-D integrated circuits. Thus, a detailed model of a three-layer irregularly structured 3-D integrated circuit with through-silicon vias and microbumps is developed, and an analytical method based on the thermal resistance network model is proposed to extract the equiv¬alent thermal conductivity of through-silicon vias and microbumps, the accuracy of which is verified by a 3-D finite element simulation method. The results show that the maximum temperature and temperature gradient obtained by the equivalent model simulations agree well with the detailed model results, proving the validity of the equivalent model. To save the computational cost, the effects of heat source area, power setting and through-silicon vias structure parameters on the maximum temperature are studied by numerical simulation method based on the equivalent model. Heat source area equal to the overlap between chip layers, high power chips close to the heat sink, and reducing through-silicon vias pitch can better reduce the maximum temperature. The results provide a reference value for thermal design and optimization of 3-D integrated circuits with irregular structures.