TY - JOUR
TI - Constructal entransy dissipation minimization for “volume-point” heat conduction based on triangular element
AU - Wei Shuhuan
AU - Chen Lingen
AU - Sun Fengrui
JN - Thermal Science
PY - 2010
VL - 14
IS - 4
SP - 1075
EP - 1088
PT - Article
AB - By taking equivalent thermal resistance, which reflects the average heat  conduction effect and is defined based on entransy dissipation, as  optimization objective, the “volume to point” constructal problem based on  triangular element of how to discharge the heat generated in a fixed volume  to a heat sink on the border through relatively high conductive link is  re-analyzed and re-optimized in this paper. The constructal shape of the  control volume with the best average heat conduction effect is deduced. For  the same parameters, the constructs based on minimization of entransy  dissipation and the constructs based on minimization of maximum temperature  difference are compared, and the results show that the constructs based on  entransy dissipation can decrease the mean temperature difference better than  the constructs based on minimization of maximum temperature difference. But  with the increase of the number of order, the mean temperature difference  does not always decrease, and there exists some fluctuations. Because the  idea of entransy describes heat transfer ability more suitably, the  optimization results of this paper can be put to engineering application of  electronic cooling.