TY - JOUR
TI - Flow of water-based Cu, CuO, and Al2O3 nanofluids heated with constant heat flux between micropipe
AU - Simsek Hatice
JN - Thermal Science
PY - 2022
VL - 26
IS - 4
SP - 2941
EP - 2954
PT - Article
AB - This study aims to analytically measure the fully developed laminar flow and  heat transfer the water-based nanofluids, Cu, CuO, and Al2O3, within a  micropipe with constant heat flux, under the temperature jump and slip rate  boundary conditions. Knudsen number, nanoparticle volumes, and ratios of  liquid layer thickness to particle radius are assumed, 0, 0.02, 0.04; 0%,  4%, %8, and 0.1, 0.2, 0.4, respectively. The findings suggest that adding  nanoparticles to flow area has significant effect on both the velocity field  and the heat transfer. There is a significant decline in the velocity both  at the core and on the walls in the velocity area, due to the increase in  the solid volume and the ratios of liquid layer thickness to particle radius  after adding nanoparticles to flow area, and the increase of Nusselt number  is significantly proportional to that of the solid volume and the ratios of  liquid layer thickness to particle radius. Among the nanoparticles, Cu, CuO,  and Al2O3, used as nanofluids within the micropipe, Cu is found to be the  one with the highest heat transfer enhancement, followed by Al2O3, and CuO,  respectively.